IP Library › Granted Patent US 8,574,529
Granted Patent B2
US 8,574,529 · App. 13/499,482 · Granted Nov 5, 2013

Silicon carbide crystal and method of manufacturing silicon carbide crystal

Inventor: Makoto Sasaki (Itami, JP)
Assignee: Sumitomo Electric Industries, Ltd.
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Quick Facts
Patent No.
US 8,574,529
App. No.
13/499,482
Granted
Nov 5, 2013
Kind
B2
Abstract

An SiC crystal has Fe concentration not higher than 0.1 ppm and Al concentration not higher than 100 ppm. A method of manufacturing an SiC crystal includes the following steps. SiC powders for polishing are prepared as a first source material. A first SiC crystal is grown by sublimating the first source material through heating and precipitating an SiC crystal. A second source material is formed by crushing the first SiC crystal. A second SiC crystal is grown by sublimating the second source material through heating and precipitating an SiC crystal. Thus, an SiC crystal and a method of manufacturing an SiC crystal capable of achieving suppressed lowering in quality can be obtained.

Claims (16)

1. A silicon carbide crystal comprising a seed substrate and a grown crystal portion formed on said seed substrate,

said grown crystal portion having concentration of iron not lower than 0.002 ppm and not higher than 0.1 ppm and concentration of aluminum not lower than 0.02 ppm and not higher than 100 ppm, and having micropipe density not higher than 2/cm 2 , and

the micropipe density of said grown crystal portion with respect to micropipe density of said seed substrate being less than 40%.

2. The silicon carbide crystal according to claim 1 , wherein said grown crystal portion has etch pit density not lower than 4100/cm 2 and not higher than 5200/cm 2 .

3. A method of manufacturing a silicon carbide crystal comprising a seed substrate and a grown crystal portion formed on said seed substrate, comprising the steps of:

preparing powders of silicon carbide for polishing as a first source material;

growing a first silicon carbide crystal by sublimating said first source material through heating and precipitating a silicon carbide crystal;

forming a second source material by crushing said first silicon carbide crystal; and

growing a second silicon carbide crystal on said seed substrate by sublimating said second source material through heating and precipitating a silicon carbide crystal,

in said step of forming a second source material, said second source material having concentration of iron not lower than 0.002 ppm and not higher than 0.1 ppm and concentration of aluminum not lower than 0.02 ppm and not higher than 100 ppm is formed,

and said grown second silicon carbide crystal having micropipe density not higher than 2/cm 2 , and the micropipe density of said grown second silicon carbide crystal with respect to micropipe density of said seed substrate being less than 40%.”

4. The method of manufacturing a silicon carbide crystal according to claim 3 , wherein

said step of forming a second source material includes the step of washing crushed said first silicon carbide crystal with an acid solution.

5. The method of manufacturing a silicon carbide crystal according to claim 3 , further comprising the steps of:

forming a third source material by crushing said second silicon carbide crystal; and

growing a third silicon carbide crystal by sublimating said third source material through heating and precipitating a silicon carbide crystal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2012
From: SASAKI, MAKOTO
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 027965/0278 →
Priority Claims (1)
JP 2010-100891 · Apr 26, 2010 · national
Continuity (1)
Related Publication 20120183466A1 · Jul 19, 2012