Semiconductor device having a conductive structure including oxide and non oxide portions
A semiconductor device includes an interlayer insulating layer disposed on a substrate, the interlayer insulating layer comprising an opening exposing the substrate, a barrier layer pattern disposed within the opening, and a conductive pattern disposed on the barrier layer pattern, the conductive pattern having an oxidized portion extending out of the opening and a non-oxidized portion within the opening, wherein a width of the conductive pattern is determined by a thickness of the barrier layer pattern.
1. A semiconductor device comprising:
an interlayer insulating layer disposed on a substrate, the interlayer insulating layer comprising an opening exposing a conductive portion on the substrate;
a barrier layer pattern disposed within the opening; and
a conductive pattern disposed on the barrier layer pattern, the conductive pattern having an oxidized portion extending out of the opening and a non-oxidized portion within the opening,
wherein a width of the conductive pattern is determined by a thickness of the barrier layer pattern, wherein a top surface of the non-oxidized portion is lower than a top surface of the interlayer insulating layer, wherein a size of a cross-sectional area of the oxidized portion in a plan view is smaller than a size of a cross-sectional area of the opening in the plan view.
2. The semiconductor device of claim 1 , wherein the width of the conductive pattern is smaller than a width of the opening.
3. The semiconductor device of claim 1 , wherein the oxidized portion extending out of the opening is thicker than an oxidized portion disposed within the opening.
4. The semiconductor device of claim 1 , wherein a width of the oxidized portion is substantially the same as a width of the non-oxidized portion.
5. The semiconductor device of claim 1 , wherein a width of the oxidized portion is larger than a width of the non-oxidized portion.
6. The semiconductor device of claim 1 , further comprising a filling pattern disposed within the opening such that the conductive pattern is disposed between the barrier layer pattern and the filling pattern.
7. The semiconductor device of claim 6 , wherein the conductive pattern has a cylindrical shape.
8. The semiconductor device of claim 1 , wherein the conductive pattern comprises tungsten.
9. The semiconductor device of claim 1 , wherein the barrier layer pattern comprises at least one of titanium or titanium nitride.
10. The semiconductor device of claim 1 , wherein the barrier layer pattern comprises at least one of nitride or oxynitride.
11. The semiconductor device of claim 1 , wherein the oxidized portion of the conductive pattern contacts a phase change material thin film in a PRAM.
12. The semiconductor device of claim 11 , wherein the barrier layer pattern contacts a P-N diode disposed under the barrier layer pattern.
13. The semiconductor device of claim 1 , wherein the oxidized portion of the conductive pattern contacts a free layer pattern in an MRAM.
14. The semiconductor device of claim 13 , wherein the barrier layer pattern electrically contacts a MOS transistor disposed under the barrier layer pattern.
15. The semiconductor device of claim 1 , wherein the size of the cross-sectional area of the oxidized portion in the plan view is determined by a size of the cross-sectional area of the barrier layer pattern.
16. A semiconductor device comprising:
a substrate;
an insulating layer having an opening disposed on the substrate;
a metal pattern disposed on the substrate; and
a metal oxide pattern disposed on the metal pattern and inside the opening,
wherein a cross-sectional area of the entire metal oxide pattern is smaller than a cross-sectional area of the metal pattern, wherein a top surface of the metal pattern is lower than a top surface of the insulating layer, and wherein spacer is disposed between the metal oxide pattern and the insulating layer.
17. The semiconductor device of claim 16 , wherein the metal pattern comprises tungsten.
18. The semiconductor device of claim 16 , wherein a portion of the metal pattern contacting the metal oxide pattern is recessed and the recessed portion receives a protruding portion of the metal oxide pattern.
19. The semiconductor device of claim 16 , wherein the metal pattern is disposed on a P-N junction.
20. The semiconductor device of claim 16 , wherein the metal pattern is electrically connected to a MOS transistor.
21. The semiconductor device of claim 16 , wherein the metal oxide pattern contacts a free layer pattern of an MRAM.
22. The semiconductor device of claim 16 , wherein the metal oxide pattern contacts a phase change material thin film of a PRAM.
23. The semiconductor device of claim 22 , wherein a spacer is disposed between the phase change material thin film and the insulating layer.
24. The semiconductor device of claim 22 , wherein a top portion of the phase change material thin film has a wider width than a width of a bottom portion of the phase change material.
25. A semiconductor device comprising:
a first insulating layer disposed on a substrate;
a second insulating layer disposed on the first insulating layer, the second insulating layer comprising an opening;
a third insulating layer disposed on the second insulating layer;
a fourth insulating layer disposed on the third insulating layer;
a memory storage device disposed in the fourth insulating layer; and
a conductive pattern for heating the memory storage device, the conductive pattern comprising a metal pattern and a metal oxide pattern,
wherein the metal pattern is disposed in the opening of the second insulating layer, the metal oxide pattern is disposed in the third insulating layer, and a width of the conductive pattern is smaller than a width of the opening.
26. The semiconductor device of claim 25 , further comprising a MOS transistor disposed in the first insulating layer and a free layer pattern of an MRAM disposed in the fourth insulating layer.
27. The semiconductor device of claim 25 , further comprising a P-N diode disposed in the first insulating layer and a phase change thin film disposed in the fourth insulating layer.
28. The semiconductor device of claim 25 , wherein a top surface of the metal oxide pattern is disposed on a same plane with a top surface of the third insulating layer.
29. The semiconductor device of claim 25 , further comprising a metal barrier pattern disposed between the metal pattern and the third insulating layer.
30. The semiconductor device of claim 29 , wherein a top surface of the metal barrier pattern is disposed on a same plane with a top surface of the second insulating layer.
31. The semiconductor device of claim 29 , wherein a top surface of the metal pattern is disposed lower than a top surface of the metal barrier pattern.
32. The semiconductor device of claim 25 , wherein a top surface of the third insulating layer is disposed higher than a top surface of the metal pattern.