Transceiver and interface for IC package

1. An interconnect system comprising:

a host circuit board;

an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die;

a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board; and

a second connector connected directly to the host circuit board and arranged to connect the transceiver directly to the host circuit board so that at least some electrical signals are transmitted directly to and from the host circuit board.

2. An interconnect system according to claim 1 , wherein the IC circuit board includes a plurality of solder balls arranged in a ball grid array.

3. An interconnect system according to claim 1 , wherein the second connector is a zero-insertion-force connector.

4. An interconnect system according to claim 1 , wherein the second connector includes a latch that is arranged to connect the transceiver to the second connector.

5. An interconnect system according to claim 1 , wherein the second connector includes a clip that is arranged to connect the transceiver to the second connector by being inserted through a printed circuit board of the transceiver.

6. An interconnect system according to claim 1 , wherein the second connector and the transceiver are connected with a screw.

7. An interconnect system according to claim 1 , wherein power is transmitted to the host circuit board through the second connector.

8. An interconnect system according to claim 1 , wherein the first connector is an edge-card connector.

9. An interconnect system according to claim 1 , wherein the transceiver includes a cable through which the transceiver receives and transmits electrical signals.

10. An interconnect system according to claim 1 , wherein:

the transceiver includes a circuit board and a cavity; and

the cavity and the circuit board are arranged such that the cable is attached to the circuit board at an angle with respect to the circuit board.

11. An interconnect system according to claim 1 , wherein the transceiver further includes an optical engine arranged to convert optical signals into electrical signals and arranged to convert electrical signals into optical signals.

12. An interconnect system according to claim 11 , wherein optical signals are converted to electrical signals and transmitted to the IC package through the first connector.

13. An interconnect system according to claim 1 , wherein the IC package includes at least one additional first connector.

14. A system comprising:

a host circuit board;

a package including first and second connectors;

a third connector connected to the host circuit board but not connected to the package; and

a transceiver including:

a fourth connector arranged to mate with the second connector; and

an interface arranged to mate with the third connector; wherein

the package is mounted to the host circuit board through the first connector;

the second connector is connected to the package but is not connected to the host circuit board.

15. A system according to claim 14 , wherein the transceiver further includes a cable with at least one optical fiber and at least one copper cable.

16. A system according to claim 14 , wherein the third connector provides mechanical retention for the transceiver.

17. A system according to claim 14 , wherein the third connector provides latching for the transceiver.

18. A system according to claim 14 , wherein the third connector provides electrical connections between the transceiver and the host circuit board without going through the package.

19. A system according to claim 14 , wherein the transceiver further comprises an optical engine arranged to convert electrical signals into optical signals and to convert optical signals into electrical signals.

20. A system according to claim 14 , wherein the transceiver further includes at least one permanently attached copper cable.