Compound semiconductor device and method for manufacturing the same
A compound semiconductor device includes: a substrate; a GaN compound semiconductor multilayer structure disposed over the substrate; and a stress relief layer which is AlN-based and which is disposed between the substrate and the GaN compound semiconductor multilayer structure, wherein a surface of the stress relief layer that is in contact with the GaN compound semiconductor multilayer structure includes recesses that have a depth of 5 nm or more and that are formed at a number density of 2×10 10 cm −2 or more.
1. A compound semiconductor device comprising:
a substrate;
a GaN compound semiconductor multilayer structure disposed over the substrate; and
a stress relief layer which is AlN-based and which is disposed between the substrate and the GaN compound semiconductor multilayer structure,
wherein a surface of the stress relief layer that is in contact with the GaN compound semiconductor multilayer structure has recesses that have a depth of 5 nm or more and that are formed at a number density of 2×10 10 cm −2 or more.
2. The compound semiconductor device according to claim 1 , wherein the surface of the stress relief layer that is in contact with the GaN compound semiconductor multilayer structure has recesses that have a depth of 6 nm or more and that are formed at a number density of 2×10 10 cm −2 or more.
3. The compound semiconductor device according to claim 1 wherein each of the recesses has a diameter of 30 nm or more.
4. The compound semiconductor device according to claim 1 , wherein each of the recesses has a diameter of 80 nm or more.
5. The compound semiconductor device according to claim 1 , wherein a skewness of a roughness curve fitted to the surface of the stress relief layer that is in contact with the GaN compound semiconductor multilayer structure is negative.
6. The compound semiconductor device according to claim 1 , wherein the GaN compound semiconductor multilayer structure includes an electron travel layer and an electron supply layer.
7. The compound semiconductor device according to claim 6 , further comprising a source electrode, gate electrode, and drain electrode disposed over the electron supply layer.
8. The compound semiconductor device according to claim 1 , wherein the substrate is a Si substrate, a SiC substrate, or a sapphire substrate.
9. A power supply system including a compound semiconductor device, the compound semiconductor device comprising:
a substrate;
a GaN compound semiconductor multilayer structure disposed over the substrate; and
a stress relief layer which is AlN-based and which is disposed between the substrate and the GaN compound semiconductor multilayer structure,
wherein a surface of the stress relief layer that is in contact with the GaN compound semiconductor multilayer structure has recesses that have a depth of 5 nm or more and that are formed at a number density of 2×10 10 cm −2 or more.
10. A high-power amplifier including a compound semiconductor device, the compound semiconductor device comprising:
a substrate;
a GaN compound semiconductor multilayer structure disposed over the substrate; and
a stress relief layer which is AlN-based and which is disposed between the substrate and the GaN compound semiconductor multilayer structure,
wherein a surface of the stress relief layer that is in contact with the GaN compound semiconductor multilayer structure has recesses that have a depth of 5 nm or more and that are formed at a number density of 2×10 10 cm −2 or more.