Flex-rigid wiring board and method for manufacturing the same

1. A flex-rigid wiring board comprising:

a flexible cable section comprising a metal clad laminate core and a shielding layer on an outer surface outward from the metal clad laminate core; and

a rigid mounting section having a wiring layer provided on the same surface as the shielding layer, wherein:

the shielding layer and the wiring layer are made of a same sheet of continuous metal foil, and the wiring layer is plated and is made thicker than the shielding layer.

2. The flex-rigid wiring board according to claim 1 , further comprising:

a same continuous insulating layer provided on outer sides of the shielding layer and the wiring layer of the mounting section.

3. The flex-rigid wiring board according to claim 2 , further comprising:

a metal layer provided on outer sides of the continuous insulating layer.

4. The flex-rigid wiring board according to claim 3 , further comprising:

a solder resist provided on outer sides of the metal layer.

5. The flex-rigid wiring board according to claim 1 , wherein the outer surface is a surface of an insulating layer.

6. The flex-rigid wiring board according to claim 5 , wherein the insulating layer comprises polyimide.

7. The flex-rigid wiring board according to claim 1 , wherein the shielding layer comprises copper.

8. The flex-rigid wiring board according to claim 1 , wherein the shielding layer has a thickness falling in the range of 3 to 12 micrometers.

9. The flex-rigid wiring board according to claim 1 , wherein the metal clad laminate core is a copper clad laminate core.

10. The flex-rigid wiring board according to claim 1 , wherein the metal clad laminate core comprises a base film.

11. The flex-rigid wiring board according to claim 10 , wherein the base film comprises polyimide.

12. A method for manufacturing a flex-rigid wiring board consisting of a flexible cable section having a shielding layer on an outer surface, and a rigid mounting section having a wiring layer provided on the same surface as the shielding layer, the method comprising:

laminating a metal clad laminate core with an insulating layer;

providing a sheet of metal foil thinner than the wiring layer on an outer surface of the insulating layer;

masking an area of the sheet of metal foil which is to be formed as the cable section with a resist material; and

plating an area of the sheet of metal foil which is not masked and is to be formed as the mounting section to form the wiring layer with a thickness greater than the shielding layer, wherein:

an area of the sheet of metal foil which is masked in the cable section is to be formed as the shielding layer.

13. The method for manufacturing the flex-rigid wiring board according to claim 12 , wherein the insulating layer is a first insulating layer and the method further comprises:

providing a second insulating layer on outer sides of the shielding layer and the wiring layer of the mounting section in the same act.

14. The method for manufacturing the flex-rigid wiring board according to claim 12 , wherein the insulating layer comprises polyimide.

15. The method for manufacturing the flex-rigid wiring board according to claim 12 , wherein the sheet of metal foil is a sheet of copper foil.

16. The method for manufacturing the flex-rigid wiring board according to claim 12 , the method further comprising:

removing the resist material.

17. The method for manufacturing the flex-rigid wiring board according to claim 12 , the method further comprising:

forming, in the rigid mounting section, at least one via hole through at least the sheet of metal foil and the insulating layer.

18. The method for manufacturing the flex-rigid wiring board according to claim 17 , the method further comprising:

performing a desmearing process after forming the at least one via hole.