IP Library › Granted Patent US 8,605,919
Granted Patent B2
US 8,605,919 · App. 12/957,678 · Granted Dec 10, 2013

Microphone

Inventors: Ryuji Awamura (Fukuoka, JP); Noriaki Hanada (Fukuoka, JP); Kensuke Nakanishi (Fukuoka, JP); Tetsuo Toyoda (Yao, JP)
Assignee: Hosiden Corporation
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Quick Facts
Patent No.
US 8,605,919
App. No.
12/957,678
Granted
Dec 10, 2013
Kind
B2
Abstract

A microphone has a housing ( 9 ) defining an acoustic hole ( 99 ) and having inner faces. The microphone includes a MEMS capacitor ( 1 ) secured to and electrically connected with a first face ( 6 ) of the inner faces of the housing ( 9 ), the first face defining the acoustic hole ( 99 ), a detecting circuit ( 7 ) secured to and electrically connected with a second face ( 8 ) of the inner faces of the housing ( 9 ), the second face ( 8 ) being not adjacent the first face ( 6 ), the detecting circuit ( 7 ) detecting at least a change in the electrostatic capacity of the MEMS capacitor ( 1 ). The microphone further includes a flexible substrate ( 4 ) secured to the first face ( 6 ) and the second face ( 8 ) and disposed under a bent state inside the housing ( 9 ). The flexible substrate ( 4 ) establishes electrical connection between the MEMS capacitor ( 1 ) and the detecting circuit ( 7 ) via a wire electrically connecting the first face ( 6 ) and the second face ( 8 ).

Claims (7)

1. A microphone having a housing defining an acoustic hole and having inner faces, comprising:

a MEMS capacitor secured to and electrically connected with a first face of said inner faces of the housing, said first face defining said acoustic hole;

a detecting circuit secured to and electrically connected with a second face of said inner faces of the housing, said second face being not adjacent said first face, said detecting circuit detecting at least a change in the electrostatic capacity of said MEMS capacitor; and

a flexible substrate secured to said first face and said second face and disposed under a bent state inside said housing, said flexible substrate establishing electrical connection between said MEMS capacitor and said detecting circuit via a wire electrically connecting said first face and said second face,

wherein said flexible substrate is configured such that the MEMS capacitor is mounted in the area of the flexible substrate secured to said first face, and

wherein said flexible substrate is configured such that the detecting circuit is mounted in the area of the flexible substrate secured to said second face.

2. The microphone according to claim 1 , wherein said detecting circuit is comprised of a single integrated circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2011
From: AWAMURA, RYUJI; HANADA, NORIAKI; NAKANISHI, KENSUKE; TOYODA, TETSUO
To: HOSIDEN CORPORATION
Reel/Frame 025802/0944 →
Priority Claims (1)
JP 2009-277831 · Dec 7, 2009 · national
Continuity (1)
Related Publication 20110135122A1 · Jun 9, 2011