Vibrating nano-scale or micro-scale electromechanical component with enhanced detection level

1. A vibrating nano-scale or micro-scale electromechanical component comprising:

a vibrating mechanical element that cooperates with at least one detection electrode,

wherein the detection electrode is flexible and is configured to vibrate in phase opposition relative to the vibrating mechanical element, and

at least one actuating electrode that cooperates with the vibrating mechanical element and that makes the mechanical element vibrate.

2. A vibrating electromechanical component of claim 1 , wherein the actuating electrode is merged with the detection electrode.

3. A vibrating electromechanical component of claim 1 , wherein the actuating and detection electrodes are situated face-to-face on either side of the vibrating mechanical element.

4. A vibrating electromechanical component of claim 1 , wherein the electromechanical element comprises plural flexible electrodes placed opposite an antinode of at least one mode of vibration of the vibrating mechanical element.

5. A vibrating electromechanical component of claim 1 , comprising plural flexible electrodes, wherein at least one of the flexible electrodes vibrates in a harmonic mode of the vibrating mechanical element, at least one other of the flexible electrodes vibrating in another harmonic mode or in a dominant mode of the vibrating mechanical element.

6. A vibrating electromechanical component of claim 1 , wherein the flexible electrode includes a beam operating in flex-mode.

7. A vibrating electromechanical component of claim 1 , wherein the vibrating mechanical element includes a beam operating in flex-mode.

8. A vibrating electromechanical component of claim 7 , wherein the beam is anchored at ends thereof or in a middle portion thereof.

9. A vibrating electromechanical component of claim 1 , wherein the vibrating mechanical element includes an elliptical mode disk or a Lamé polygonal plate.

10. A vibrating electromechanical component of claim 1 , wherein the flexible electrode has a length less than or equal to that of the vibrating mechanical element.

11. A vibrating electromechanical component of claim 1 , wherein the vibrating mechanical element has a degree of mechanical rigidity substantially equal to that of the flexible electrode.

12. A vibrating electromechanical component of claim 1 , which is a resonator or motion sensor.

13. A method of producing a vibrating nano-scale or micro-scale electromechanical component including a vibrating mechanical element, which cooperates with at least one detection electrode, which is flexible and is configured to vibrate in phase opposition relative to the vibrating mechanical element, the method comprising:

a) forming a compartment on a substrate of semiconductor material, which is bounded by dielectric material around a contour of an active region partially enclosing the vibrating mechanical element and the flexible electrode;

b) filling the compartment with a sacrificial material and then with a doped semiconductor material that overflows from the compartment to form the vibrating mechanical element and the flexible electrode;

c) etching at least one opening in the semiconductor material reaching as far as the sacrificial material to form a space between the mechanical vibrating element and the flexible electrode and to define the flexible electrode of a flexible electrode support;

d) removing the sacrificial material via the opening;

e) covering the electromechanical component with a protective material, except for the active region; and

f) producing at least one electrical contact pad on the flexible electrode, through the protective material, and outside of the active region.

14. A production method of claim 13 , wherein the electromechanical component comprises at least one other rigid electrode, the active region partially enclosing the rigid electrode, the semiconductor material filling the compartment and overflowing from the compartment, thereby producing the rigid electrode in the filling b), an opening in the semiconductor material being made to form a space between the rigid electrode and the vibrating mechanical element in the etching c), and, in the producing f), an electrical contact is produced through the protective material on the rigid electric outside of the active region.