Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin
Improved durability and longevity of spin chucks is achieved by using a composite support pin structure in which a pin body of a chemically inert plastic includes a hollow cavity containing an insert formed from a material whose Young's modulus is greater than that of the inert plastic.
1. Device for processing wafer-shaped articles, comprising a holder adapted to maintain a wafer-shaped article in a predetermined orientation during a processing operation to be performed on the article, and a plurality of support pins operatively engaged with the holder and adapted and positioned relative to the holder so as to support a wafer-shaped article to be processed on the device either from below or from an edge of the article, wherein said support pins comprise: a gear; a body formed of a chemically inert bulk material, wherein said body defines a hollow cavity and a gripping part adapted to contact a wafer-shaped article; and an insert positioned within said cavity formed of a material whose Young's modulus is greater than that of the bulk material.
2. The device according to claim 1 , wherein the holder is a spin chuck surrounded by a process chamber for single wafer wet processing of semiconductor wafers.
3. The device according to claim 1 , wherein the pins are positioned in a circular series surrounding an area where a wafer-shaped article is to be positioned on the holder, the pins being adapted to make edge contact with a wafer shaped article thereby to constrain in from lateral movement away from the predetermined position.
4. The device according to claim 1 , wherein the bulk material is a chemically inert plastic.
5. The device according to claim 1 , wherein the bulk material is selected from the group consisting of polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polystyrene/polyethylstyrene (PS/PES), ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), homopolymer of chlorotrifluoroethylene (PCTFE), fluorinated ethylene propylene (FEP), and ethylene chlorotrifluoroethylene (ECTFE).
6. The device according to claim 5 , wherein the bulk material is polytetrafluoroethylene (PTFE) or polyvinylidene fluoride (PVDF).
7. The device according to claim 1 , wherein the insert is a carbon fiber reinforced composite.
8. The device according to claim 1 , wherein the insert is stainless steel or titanium.
9. The device according to claim 1 , wherein the insert has a Young's modulus at least one order of magnitude greater than a Young's modulus of said bulk material, expressed as N/mm 2 .
10. The device according to claim 1 , wherein the insert has a Young's modulus at least two orders of magnitude greater than a Young's modulus of said bulk material, expressed as N/mm 2 .
11. A pin for use in devices for processing wafer-shaped articles, comprising: a gear; a body formed of a chemically inert bulk material, wherein said body defines a hollow cavity and a gripping part adapted to contact a wafer-shaped article; and an insert positioned within said cavity formed of a material whose Young's modulus is greater than that of the bulk material.
12. The pin according to claim 11 , wherein the bulk material is selected from the group consisting of polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polystyrene/polyethylstyrene (PS/PES), ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), homopolymer of chlorotrifluoroethylene (PCTFE), fluorinated ethylene propylene (FEP), and ethylene chlorotrifluoroethylene (ECTFE).
13. The pin according to claim 11 , wherein the insert is a carbon fiber reinforced composite or stainless steel or titanium.
14. The pin according to claim 11 , wherein the insert has a Young's modulus at least one order of magnitude greater than a Young's modulus of said bulk material, expressed as N/mm 2 .
15. The pin according to claim 14 , wherein the insert has a Young's modulus at least two orders of magnitude greater than a Young's modulus of said bulk material, expressed as N/mm 2 .