Thin film transistor method of fabricating the same
A thin film transistor includes: a silicon nanowire on a substrate, the silicon nanowire having a central portion and both side portions of the central portion; a gate electrode on the central portion; and a source electrode and a drain electrode spaced apart from the source electrode on the both side portions, the source electrode and the drain electrode electrically connected to the silicon nanowire, respectively.
1. A thin film transistor, comprising:
a silicon nanowire on a substrate, the silicon nanowire having a central portion and respective side portions of the central portion;
a fixing layer on the central portion of the silicon nanowire and the substrate, the fixing layer fixing the silicon nanowire to the substrate;
a gate electrode on the fixing layer over the central portion;
a first source electrode and a first drain electrode on the fixing layer over the respective side portions of the silicon nanowire, the first electrode spaced apart from the first source electrode, the first source electrode and the first drain electrode electrically connected to the silicon nanowire; and
a gate insulating layer on the gate electrode, the first source electrode and the first drain electrode.
2. The thin film transistor according to claim 1 , wherein the silicon nanowire includes a core of a semiconductor material and an insulating layer surrounding the core.
3. The thin film transistor according to claim 2 , wherein the silicon nanowire has a coaxial structure between the core and the insulating layer.
4. The thin film transistor according to claim 1 , wherein the silicon nanowire has a rod shape.
5. The thin film transistor according to claim 1 , wherein the silicon nanowire consists of a plurality of silicon nanowires.
6. The thin film transistor according to claim 1 , wherein the gate electrode is made of the same material as the first source and first drain electrodes.
7. The thin film transistor according to claim 1 , wherein the fixing layer includes first and second contact holes that expose portions of the first source and first drain electrodes, respectively, and the first source and first drain electrodes are connected to the silicon nanowire via the first and second contact holes, respectively.
8. The thin film transistor according to claim 1 , wherein the fixing layer includes an organic insulating material.
9. The thin film transistor according to claim 8 , wherein the organic insulating material includes one of benzocyclobutene (BCB) and acrylic resin.
10. A thin film transistor, comprising:
a silicon nanowire on a substrate, the silicon nanowire having a central portion and respective side portions of the central portion;
a fixing layer on the central portion of the silicon nanowire and the substrate, the fixing layer fixing the silicon nanowire to the substrate;
a gate insulating layer on the fixing layer;
a gate electrode on the gate insulating layer, the respective side portions of the silicon nanowire exposed outside the fixing layer, the gate insulating layer and the gate electrode; and
a first source electrode and a first drain electrode spaced apart from the first source electrode on respective side portions, the first source and first drain electrodes directly contacting the respective side portions of the silicon nanowire exposed outside the fixing layer, the gate insulating layer and the gate electrode.
11. The thin film transistor according to claim 10 , further comprising a fixing layer between the central portion of the silicon nanowire and the gate insulating layer.
12. The thin film transistor according to claim 1 , further comprising a second source electrode connected to the first source electrode and a second drain electrode connected to the first drain electrode.
13. The thin film transistor according to claim 10 , further comprising a second source electrode connected to the first source electrode and a second drain electrode connected to the first drain electrode.