Method of conveying printed circuit boards
Disclosed herein is method of operating a piece of surface mount technology manufacturing equipment. The method comprises providing a piece of surface mount technology manufacturing equipment having a first substrate transport track disposed in a first position and a second substrate transport track disposed in a second position, moving the first substrate transport track from the first position to a third position, and moving the second substrate transport track from the second position to the first position.
1. A method of operating a piece of surface mount technology manufacturing equipment, the method comprising:
providing a piece of surface mount technology manufacturing equipment including:
a transport system configured to transport substrates through the piece of surface mount technology manufacturing equipment, the transport system including a first substrate transport track and a second substrate transport track extending through the body of the piece of surface mount technology manufacturing equipment, the transport system configured to dispose the second substrate transport track directly below the first substrate transport track; and
a displacement mechanism configured to raise the first substrate transport track relative to the second substrate transport track;
moving the first substrate transport track from a first position to a third position; and
moving the second substrate transport track from a second position to the first position.
2. The method of claim 1 , wherein moving the first substrate transport track from the first position to a third position comprises moving the first substrate transport track in a vertical direction.
3. The method of claim 1 , wherein moving the second substrate transport track from the second position to the first position comprises moving the second substrate transport track in a vertical direction.
4. The method of claim 1 , wherein moving the second substrate transport track from the second position to the first position comprises moving the second substrate transport track in a horizontal direction.
5. The method of claim 1 , further comprising introducing a first substrate onto the first substrate transport track while the first transport track is disposed in the first position.
6. The method of claim 5 , further comprising processing the first substrate while the first substrate transport track is disposed in the third position.
7. The method of claim 6 , wherein processing the first substrate comprises depositing an assembly material on the first substrate.
8. The method of claim 6 , wherein processing the first substrate comprises depositing an electronic component on the first substrate.
9. The method of claim 6 , wherein processing the first substrate comprises performing an inspection operation on the first substrate.
10. The method of claim 6 , further comprising removing the first substrate from the first substrate transport track in a direction at an angle from a direction in which the first substrate was introduced onto the first substrate transport track.
11. The method of claim 6 , wherein removing the first substrate from the first substrate transport track in a direction at an angle from a direction in which the first substrate was introduced onto the first substrate transport track comprises rotating the first substrate using a cross conveyor and passing the first substrate onto an exit track.
12. The method of claim 5 , further comprising introducing a second substrate onto the second substrate transport track while the second transport track is disposed in the first position.
13. The method of claim 12 , further comprising moving the second substrate transport track from the first position to the second position while the second substrate is present on the second substrate transport track.
14. The method of claim 12 , further comprising passing the second substrate along the second substrate transport track and through the piece of surface mount technology manufacturing equipment while the second substrate transport track is disposed in the first position.
15. The method of claim 14 , further comprising performing an inspection operation on the second substrate while passing the second substrate along the second substrate track.
16. The method of claim 12 , further comprising passing the second substrate along the second substrate transport track and through the piece of surface mount technology manufacturing equipment while the second substrate transport track is disposed in the second position.
17. The method of claim 12 , further comprising removing the second substrate from the second substrate transport track in a direction at an angle from a direction in which the second substrate was introduced onto the second substrate transport track.
18. The method of claim 12 , wherein removing the second substrate from the second substrate transport track in a direction at an angle from a direction in which the second substrate was introduced onto the second substrate transport track comprises rotating the second substrate using a cross conveyor and passing the second substrate onto an exit track.
19. The method of claim 12 , further comprising transporting the second substrate into another piece of surface mount technology manufacturing equipment from the second substrate transport track while the second substrate transport track is disposed in the first position.
20. The method of claim 5 , further comprising transporting the first substrate into another piece of surface mount technology manufacturing equipment from the first substrate transport track while the first substrate transport track is disposed in the first position.