Power converter and motor driving device using the same
In order to reduce the average power of the ringing noise, the present invention provides a power converter comprising: an arm circuit including a high-voltage side switching device to which a first diode is connected in parallel and a low-voltage side switching device to which a second diode is connected in parallel; and a main power supply connected to a series circuit of the high-voltage side switching device and the low-voltage side switching device, wherein a connecting point between the high-voltage side switching device and the low-voltage side switching device is connected to a load, and a resonant frequency calculated from inductances of wirings of a closed circuit including the first diode, the second diode, and the main power supply and a capacitance across the first diode is different form that calculated from the inductances of the wirings and a capacitance across the second diode.
1. A power converter comprising:
an arm circuit including a high-voltage side switching device to which a first diode is connected in parallel and a low-voltage side switching device to which a second diode is connected in parallel; and
a main power supply connected to a series circuit of the high-voltage side switching device and the low-voltage side switching device,
wherein a connecting point between the high-voltage side switching device and the low-voltage side switching device is connected to a load, and a resonant frequency calculated from inductances of wirings of a closed circuit including the first diode, the second diode, and the main power supply and a first capacitance across the first diode is different from that calculated from the inductances of the wirings and a second capacitance across the second diode, and
wherein inductors whose inductances are different from one another are connected to the first diode and the second diode in series respectively, the wiring includes any one of the inductors, and the first capacitance across the first diode and the second capacitance across the second diode are junction capacitances.
2. The power converter according to claim 1 , wherein
the arm circuit is mounted on an insulated substrate, and
a chip area of the first diode is different from that of the second diode.
3. The power converter according to claim 1 , wherein
the arm circuit is mounted on an insulated substrate,
the first diode and the second diode include a plurality of diode chips respectively, and
a chip area of the first diode is different from that of the second diode.
4. The power converter according to claim 1 , wherein
capacitors whose capacitances are different from one another are connected to the first diode and the second diode in parallel respectively.
5. The power converter according to claim 1 , wherein
the first diode and the second diode are Schottky barrier diodes made of materials whose bandgaps are larger than that of a silicon.
6. The power converter according to claim 5 , wherein
the material comprises one of a silicon carbide or a gallium nitride.
7. A power converter comprising:
an arm circuit including a high-voltage side switching device to which a first diode is connected in parallel and a low-voltage side switching device to which a second diode is connected in parallel; and
a main power supply connected to a series circuit of the high-voltage side switching device and the low-voltage side switching device,
wherein a connecting point between the high-voltage side switching device and the low-voltage side switching device is connected to a load, and a resonant frequency calculated from inductances of wirings of a closed circuit including the first diode, the second diode, and the main power supply and a first capacitance across the first diode is different from that calculated from the inductances of the wirings and a second capacitance across the second diode, and
wherein a dispersion of the resonant frequency is within a range of (½) 1/2 times to 2 1/2 times.
8. The power converter according to claim 7 , wherein the arm circuit is mounted on an insulated substrate, and a chip area of the first diode is different from that of the second diode.
9. The power converter according to claim 7 , wherein the arm circuit is mounted on an insulated substrate, the first diode and the second diode include a plurality of diode chips respectively, and a chip area of the first diode is different from that of the second diode.
10. The power converter according to claim 7 , wherein capacitors whose capacitances are different from one another are connected to the first diode and the second diode in parallel respectively.
11. The power converter according to claim 7 , wherein the first diode and the second diode are Schottky barrier diodes comprised of materials whose bandgaps are larger than that of a silicon.
12. The power converter according to claim 11 , wherein the material comprises one of a silicon carbide or a gallium nitride.