IP Library Granted Patent US 8,623,224
Granted Patent B2
US 8,623,224 · App. 13/339,703 · Granted Jan 7, 2014

Method for making patterned conductive element

Inventors: Jia-Shyong Cheng (New Taipei, TW); Po-Shan Huang (New Taipei, TW); Po-Sheng Shih (New Taipei, TW); Chun-Yi Hu (New Taipei, TW); Chih-Han Chao (New Taipei, TW); Jeah-Sheng Wu (New Taipei, TW)
Assignee: Shih Hua Technology Ltd.
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Quick Facts
Patent No.
US 8,623,224
App. No.
13/339,703
Granted
Jan 7, 2014
Kind
B2
Abstract

The present disclosure relates to a method for making pattern conductive element. The method includes steps. A substrate having a surface is provide. An adhesive layer is formed on the surface of the substrate. Part of the adhesive layer is solidified to form a solidified adhesive layer and a non-solidified adhesive layer. A carbon nanotube layer is applied on the adhesive layer. The non-solidified adhesive layer is solidified so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer. The non-fixed carbon nanotube layer is removed and the fixed carbon nanotube layer is remained to form a pattern carbon nanotube layer.

Claims (25)

1. A method for making a patterned conductive element, the method comprising:

providing a substrate;

applying an adhesive layer on a surface of the substrate;

forming a solidified adhesive layer and a non-solidified adhesive layer by partially solidifying the adhesive layer;

placing a carbon nanotube layer on a surface of the adhesive layer;

solidifying the non-solidified adhesive layer so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer; and

removing the non-fixed carbon nanotube layer to obtain a patterned carbon nanotube layer.

2. The method of claim 1 , wherein the adhesive layer is formed by spin-coating, spraying, or brushing.

3. The method of claim 1 , wherein the adhesive layer comprises thermoplastic and is solidified by cooling.

4. The method of claim 1 , wherein the adhesive layer comprises thermosetting material and is solidified by heating.

5. The method of claim 1 , wherein the adhesive layer comprises UV glue and is solidified by ultraviolet light irradiating.

6. The method of claim 5 , wherein the partially solidifying the adhesive layer comprises:

sheltering the adhesive layer by a mask;

irradiating the adhesive layer with ultraviolet light; and

removing the mask.

7. The method of claim 6 , wherein the mask is suspended above the adhesive layer.

8. The method of claim 1 , wherein the carbon nanotube layer is formed by filtering and depositing a carbon nanotube suspension.

9. The method of claim 1 , wherein the carbon nanotube layer is formed by drawing a free-standing carbon nanotube film from a carbon nanotube array; and laying the free-standing carbon nanotube film on the adhesive layer directly.

10. The method of claim 9 , wherein at least two free-standing carbon nanotube films are stacked on the adhesive layer.

11. The method of claim 1 , wherein after applying the carbon nanotube layer on the adhesive layer, the carbon nanotube layer on the solidified adhesive layer is only located on a surface of the solidified adhesive layer, and the carbon nanotube layer on the non-solidified adhesive layer is infiltrated into the non-solidified adhesive layer.

12. The method of claim 11 , wherein the carbon nanotube layer on the non-solidified adhesive layer comprises a plurality of carbon nanotubes infiltrated into and extending out of the non-solidified adhesive layer.

13. The method of claim 1 , further comprising pressing the carbon nanotube layer after applying the carbon nanotube layer on the adhesive layer.

14. The method of claim 1 , wherein the non-fixed carbon nanotube layer is removed by stripping using an adhesive tape.

15. The method of claim 1 , wherein the non-fixed carbon nanotube layer is removed by peeling using a roller having an adhesive outer surface.

16. The method of claim 1 , wherein the non-fixed carbon nanotube layer is removed by laser-beam etching, ion-beam etching, or electron-beam etching.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2021
From: SHIH HUA TECHNOLOGY LTD.
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 056969/0176 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2011
From: CHENG, JIA-SHYONG; HUANG, PO-SHAN; SHIH, PO-SHENG; HU, CHUN-YI; CHAO, CHIH-HAN; WU, JEAH-SHENG
To: SHIH HUA TECHNOLOGY LTD.
Reel/Frame 027458/0031 →
Priority Claims (1)
TW 100120203 A · Jun 9, 2011 · national
Continuity (1)
Related Publication 20120312773A1 · Dec 13, 2012