Electronic device having optical communicating part
An electronic device includes a substrate having a first surface and a second surface, a semiconductor device disposed on a first region on the first surface of the substrate, a via structure penetrating the substrate, and including a conductor, an optical channel disposed in the via structure, and an optical-electrical converting device disposed at an end of the via structure, electrically connected to the semiconductor device through the conductor of the via structure, and optically connected to the optical channel.
1. An electronic device comprising:
a substrate having a first surface and a second surface;
a semiconductor device disposed on a first region on the first surface of the substrate;
a via structure that penetrates a second region of the substrate, the via structure including a conductor electrically connected to the semiconductor device;
an optical channel disposed in the via structure; and
an optical-electrical converting device that is disposed at an end of the via structure, electrically connected to the semiconductor device through the conductor of the via structure, and optically connected to the optical channel.
2. The electronic device according to claim 1 , wherein the via structure includes a via hole penetrating the second region of the substrate, and the conductor includes a metallic via liner formed on an inner wall of the via hole.
3. The electronic device according to claim 2 , wherein the optical-electrical converting device is electrically connected to the metallic via liner.
4. The electronic device according to claim 3 , wherein the substrate includes a core layer and a metal layer, and the metal layer is electrically connected to the via liner and the semiconductor device.
5. The electronic device according to claim 1 , wherein the optical-electrical converting device is disposed on the second surface opposite the first surface of the substrate.
6. The electronic device according to claim 5 , wherein the optical-electrical converting device is bonded to the second surface of the substrate using an adhesive.
7. The electronic device according to claim 6 , wherein the adhesive is provided between the optical-electrical converting device and the second surface of the substrate, and in the via structure.
8. The electronic device according to claim 7 , wherein the adhesive includes a material transparent to a wavelength of light used for transmitting a signal through the optical channel, and opaque to ultraviolet (UV) light.
9. The electronic device according to claim 1 , wherein the optical channel is fixed by a fixing member provided on the first surface of the substrate.
10. The electronic device according to claim 1 , wherein the optical channel includes a core, a cladding and an external coating part,
the core and the cladding are embedded into the via structure, and
the external coating part is not embedded into the via structure.
11. The electronic device according to claim 1 , wherein the core and the cladding are surrounded by the conductor.
12. The electronic device according to claim 1 , wherein the substrate includes a recessed region on the second surface, and the optical-electrical converting device is disposed in the recessed region.
13. The electronic device according to claim 1 , wherein the optical-electrical converting device includes a plurality of optical-electrical converters.
14. An electronic device comprising:
a substrate;
a semiconductor device disposed on a top surface of the substrate;
a via structure penetrating through a surface of the substrate and an interior the substrate, the via structure including a via hole and a conductive via liner;
an optical-electrical converting device that is disposed in the substrate, partially exposed by the via structure, and electrically connected to the semiconductor device by the conductive via liner; and
an optical channel that is disposed in the via structure, and optically connected to the optical-electrical converting device.
15. The electronic device according to claim 14 , wherein the substrate includes a core layer and metal layers, and
the core layer is partially removed to constitute a part of the via hole of the via structure.
16. An electronic device comprising:
a substrate;
a semiconductor device disposed on a surface of the substrate;
a via structure formed in the surface of the substrate in a location other that a location of the semiconductor device, the via structure extending into the substrate and comprising a via hole and a conductive liner;
an optical-electrical converting device disposed at an end of the via structure opposite an end of the via structure that enters the surface of the substrate, the optical-electrical converting device optically exposed to the via structure and electrically connected to the semiconductor device through the conductive liner of the via structure; and
an optical channel extending into the via structure, and optically coupled to the optical-electrical converting device.
17. The electrical device according to claim 16 , wherein the optical-electrical converting device is provided inside the substrate.
18. The electrical device according to claim 16 , wherein the via structure extends completely through the substrate, and the optical-electrical converting device is provided on an opposite surface of the substrate from the surface on which semiconductor device is disposed.
19. The electrical device according to claim 16 , wherein the optical channel comprises first portion that extends into the via structure, and a second portion extending from the via structure to an outside of the electronic device,
the first portion comprises a core and a cladding surrounding the core, and
the second portion comprises the core, the cladding, and a protective coating surrounding the cladding.
20. The electrical device according to claim 19 , wherein the conductive liner surrounds the cladding at the first portion.