Substrate temperature regulation fixed apparatus
A substrate temperature regulation fixed apparatus has a base substance on which a vacuumed object is placed, an adhesive layer and a base plate. The base substance is fixed on the base plate through the adhesive layer. The adhesive layer contains a substance having plasma resistance.
1. A substrate temperature regulation fixed apparatus comprising:
an electrostatic chuck on which a vacuumed object is placed;
an adhesive layer comprising a silicon adhesive and a member having a plurality of openings in a net-shape provided along a peripheral edge of the adhesive layer in plan view, the silicon adhesive being filled in the plurality of openings; and
a base plate having a cooling passage contained therein,
wherein the electrostatic chuck is fixed on the base plate through the adhesive layer to form a stacked structure with the base plate being under the electrostatic chuck,
wherein at a radially inner portion of the adhesive layer that does not include the member having a plurality of openings in a net-shape, only the silicon adhesive is formed between the electrostatic chuck and the base plate,
wherein the member having a plurality of openings is formed of a fluorine resin as a main component, and
wherein the member is included in a peripheral part of a through hole of the adhesive layer in plan view.
2. A substrate temperature regulation fixed apparatus as claimed in claim 1 , wherein the fluorine resin is polytetrafluoroethylene.
3. A substrate temperature regulation fixed apparatus as claimed in claim 1 , further comprising:
a gas passage extending through the electrostatic chuck and the adhesive layer, the gas passage introducing an inert gas, whose pressure is regulated, in a space formed by an upper surface of the electrostatic chuck and a lower surface of the vacuumed object,
wherein the member is included so as to surround a portion through which the gas passage of the adhesive layer extends in plan view.