Wiring substrate
A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.
1. A wiring substrate comprising: a pair of differential wirings; a first insulating layer that is provided adjacent to one side of the pair of differential wirings, the first insulating layer including first fiber bundles disposed in parallel to an extending direction of the pair of differential wirings; a second insulating layer that is provided adjacent to another side of the pair of differential wirings, the second insulating layer including second fiber bundles disposed in parallel to the extending direction of the pair of differential wirings, the second fiber bundles being disposed by the same pitch as the first fiber bundles; a third insulating layer that is provided on a side of the first insulating layer and opposite to a side of the first insulating layer that is adjacent to the pair of differential wirings, the third insulating layer including third fiber bundles disposed in parallel to the extending direction of the pair of differential wirings; and a fourth insulating layer that is provided on a side of the second insulating layer and opposite to a side of the second insulating layer that is adjacent to the pair of differential wirings, the fourth insulating layer including fourth fiber bundles disposed in parallel to the extending direction of the pair of differential wirings, wherein intervals between the third fiber bundles and intervals between the fourth fiber bundles are respectively narrower than intervals between the first fiber bundles and intervals between the second fiber bundles, and the pair of differential wirings are disposed between adjacent ones of the first fiber bundles at positions that do not overlap the first fiber bundles in a planar view, and are disposed between adjacent ones of the second fiber bundles at positions that do not overlap the second fiber bundles in a planar view.
2. The wiring substrate according to claim 1 , wherein wiring widths of the pair of differential wirings are wider than widths of the first fiber bundles and widths of the second fiber bundles.
3. The wiring substrate according to claim 1 , wherein widths of the third fiber bundles and widths of fourth fiber bundles are narrower than the wiring widths of the pair of differential wirings.
4. The wiring substrate according to claim 1 , wherein the first insulating layer further includes fifth fiber bundles intersecting the first fiber bundles, the second insulating layer further includes sixth fiber bundles intersecting the second fiber bundles, and a pitch of the fifth fiber bundles and a pitch of the sixth fiber bundles are narrower than the pitch of the first fiber bundles and the second fiber bundles.