AlGaN/GaN hybrid MOS-HFET
A field effect transistor (FET) includes source and drain electrodes, a channel layer, a barrier layer over the channel layer, a passivation layer covering the barrier layer for passivating the barrier layer, a gate electrode extending through the barrier layer and the passivation layer, and a gate dielectric surrounding a portion of the gate electrode that extends through the barrier layer and the passivation layer, wherein the passivation layer is a first material and the gate dielectric is a second material, and the first material is different than the second material.
1. A field effect transistor (FET) comprising:
a source electrode;
a drain electrode;
a channel layer;
a barrier layer over the channel layer and coupled to the source and drain electrodes;
a gate electrode extending through the barrier layer;
a passivation layer over the barrier layer for passivating the barrier layer between the gate electrode and the source electrode and between the gate electrode and the drain electrode, wherein the gate electrode extends through the passivation layer; and
a gate dielectric surrounding the portion of the gate electrode that extends through the barrier layer and the passivation layer;
wherein the gate dielectric is annealed to improve an interface between the gate dielectric and the channel layer for reducing electron trap density and increasing channel mobility;
wherein the passivation layer is a first material and the gate dielectric is a second material; and
wherein the first material is different than the second material.
2. The FET of claim 1 wherein:
the channel layer is GaN, InN, or InGaN;
the barrier layer is AlGaN, AlN, AlInN, a combination of AlN spacer and AlGaN barrier, or a combination of AlN spacer and InAlN barrier;
the passivation layer is SiN, SiO 2 , Al 2 O 3 , HfO 2 , TiO 2 , amorphous AlN, or polycrystalline AlN;
the gate dielectric is Al 2 O 3 , hafnium oxide (HfO 2 ), titanium oxide (TiO 2 ), SiN, SiO 2 , amorphous AlN, or polycrystalline AlN.
3. The FET of claim 1 wherein:
the gate dielectric is formed using atomic layer deposition.
4. The FET of claim 1 wherein:
the passivation layer is formed using plasma enhanced chemical vapor deposition (PECVD), metal-organic chemical vapor deposition (MOVCD), atomic layer deposition (ALD), molecular beam epitaxy (MBE), e-beam evaporation, or sputtering.
5. The FET of claim 1 wherein the gate dielectric covers the passivation layer.
6. The FET of claim 1 wherein:
the barrier layer is etched away to the channel layer in a region of the gate electrode using atomic layer etching (ALE).
7. The FET of claim 1 wherein:
the passivation layer is in the range of 20 to 100 nm thick; and
the gate dielectric is in the range of 2-20 nm thick.
8. The FET of claim 1 wherein the figure of merit Vb 2 /R on,sp is approximately 260 MW/cm 2 .
9. The FET of claim 1 wherein the channel layer further comprises a polarization induced 2DEG away from the gate electrode.
10. The FET of claim 1 wherein the FET is normally-off when the gate electrode is at zero bias.
11. The FET of claim 1 wherein the FET is a hybrid MOS-HFET.
12. The FET of claim 1 wherein a periphery of the gate is between 200 μm to 20 mm.
13. A method of fabricating a field effect transistor comprising:
forming a channel layer;
forming a barrier layer over the channel layer;
forming a passivation layer over the barrier layer;
etching away a first area of the passivation layer for a source electrode and a second area of the passivation layer for a drain electrode;
forming a source electrode and a drain electrode on the barrier layer;
etching away a third area of the passivation layer and a fourth area extending through the barrier layer for a gate electrode;
forming a gate dielectric on the surface of the third area and the fourth area;
annealing the gate dielectric; and
forming a gate electrode in the third area and in the fourth area;
wherein the passivation layer is a first material and the gate dielectric is a second material; and
wherein the first material is different than the second material.
14. The method of claim 13 wherein:
the channel layer is GaN, InN, or InGaN;
the barrier layer is AlGaN, AlN, AlInN, a combination of AlN spacer and AlGaN barrier, or a combination of AlN spacer and InAlN barrier;
the passivation layer is SiN, SiO 2 , Al 2 O 3 , HfO 2 , TiO 2 , amorphous AlN, or polycrystalline AlN;
the gate dielectric is Al 2 O 3 , hafnium oxide (HfO 2 ), titanium oxide (TiO 2 ), SiN, SiO 2 , amorphous AlN, or polycrystalline AlN.
15. The method of claim 13 wherein:
the gate dielectric is formed using atomic layer deposition.
16. The method of claim 13 wherein:
the passivation layer is formed using plasma enhanced chemical vapor deposition (PECVD), metal-organic chemical vapor deposition (MOVCD), atomic layer deposition (ALD), molecular beam epitaxy (MBE), e-beam evaporation, or sputtering.
17. The method of claim 13 wherein the gate dielectric covers the passivation layer.
18. The method of claim 13 further comprising
etching the barrier layer to the channel layer in the fourth area using atomic layer etching (ALE).
19. The method of claim 13 wherein:
the passivation layer is in the range of 20 to 100 nm thick; and
the gate dielectric is in the range of 2-20 nm thick.
20. The method of claim 13 wherein the figure of merit Vb 2 /Ron is approximately 260 MW/cm 2 .
21. The method of claim 13 wherein the channel layer further comprises a polarization induced 2DEG away from the gate electrode.
22. The method of claim 13 wherein the FET is normally-off when the gate electrode is at zero bias.
23. The method of claim 13 wherein the FET is a hybrid MOS-HFET.
24. The method of claim 13 wherein etching away a third area of the passivation layer and a fourth area extending through the barrier layer for a gate electrode comprises atomic layer etching.