FinFET and method of fabricating the same

1. A fin field effect transistor (FinFET) comprising:

a substrate comprising a major surface;

a first fin and a second fin extending upward from the substrate major surface to a first height; and

an insulation layer comprising a top surface extending upward from the substrate major surface to a second height less than the first height, whereby portions of the fins extend beyond the top surface of the insulation layer,

wherein each fin is covered by a bulbous epitaxial layer defining an hourglass shaped cavity between adjacent fins, the cavity comprising upper and lower portions, and wherein the bulbous epitaxial layer bordering the lower portion of the cavity is converted to silicide.

2. The FinFET of claim 1 , wherein a ratio of the second height to the first height is from about 0.5 to about 0.8.

3. The FinFET of claim 1 , wherein a minimum width of the hourglass shaped cavity is from about 3 nm to about 10nm.

4. The FinFET of claim 1 , wherein a ratio of a minimum width of the hourglass shaped cavity to a maximum width of the hourglass shaped cavity is from about 0.1 to about 0.5.

5. The FinFET of claim 1 , wherein the bulbous epitaxial layer bordering the lower portion of the cavity is fully converted to silicide.

6. The FinFET of claim 1 , wherein the bulbous epitaxial layer bordering the upper portion of the cavity is converted to silicide thicker than the silicide bordering the lower portion of the cavity.

7. The FinFET of claim 1 , wherein the bulbous epitaxial layer comprises SiP, SiC, or SiGe.

8. The FinFET of claim 1 , wherein the bulbous epitaxial layer comprises a II-VI semiconductor material or a III-V semiconductor material.

9. The FinFET of claim 1 , wherein the silicide comprises a material selected from the group consisting of titanium silicide, cobalt silicide, nickel silicide, platinum silicide, erbium silicide, and palladium silicide.

10. The FinFET of claim 1 , wherein the lower portion of the cavity comprises a first metal material below the silicide bordering the lower portion of the cavity.

11. The FinFET of claim 10 , wherein the first metal material comprises a material selected from the group consisting of titanium, cobalt, nickel, platinum, erbium, and palladium.

12. The FinFET of claim 1 , wherein the upper and lower portions of the cavity comprise a second metal material.

13. The FinFET of claim 12 , wherein the second metal material comprises Al, Cu, or W.

14. A fin field effect transistor (FinFET) comprising:

a substrate comprising a major surface;

a first fin and a second fin extending upward from the substrate major surface;

an insulation material on the major surface between the first fin and the second fin;

a bulbous epitaxial layer over each of the first fin and the second fin, the bulbous epitaxial layer defines an hourglass shaped cavity between the first fin and the second fin; and

a first metal material over a top surface of the insulation material in the hourglass shaped cavity.

15. The FinFET of claim 14 , further comprising a silicide layer surrounding the bulbous epitaxial layer.

16. The FinFET of claim 14 , wherein the bulbous epitaxial layer is a silicide material.

17. The FinFET of claim 14 , further comprising a gate structure over the first fin and the second fin, wherein the bulbous epitaxial layer over the first fin and the second fin are positioned adjacent to the gate structure.

18. The FinFET of claim 14 , wherein a ratio of a minimum width of the hourglass shaped cavity to a maximum width of the hourglass shaped cavity is from about 0.1 to about 0.5.

19. The FinFET of claim 14 , wherein the bulbous epitaxial layer is a multilayer structure.

20. The FinFET of claim 14 , further comprising a second metal material surrounding the bulbous epitaxial layer and the first metal material.