Triangular phased array antenna subarray
Antenna subassemblies suitable for use in phased array antennas are disclosed, as are phased array antenna assemblies and aircraft comprising phased array antenna assemblies. In one embodiment, an antenna subarray assembly comprises a thermally conductive foam substrate, a plurality of radiating elements bonded to the foam substrate, and a radome disposed adjacent the radiating elements. The subarray assembly presents a triangular shape when viewed in plan view, and the plurality of radiating elements are arranged in a triangular array on the foam substrate. In some embodiments, a plurality of subarray assemblies may be assembled to form an antenna assembly. In further embodiments an aircraft may be fitted with one or more antenna assemblies. Other embodiments may be described.
1. An antenna subarray assembly, comprising:
a thermally conductive foam substrate;
a plurality of radiating elements bonded to the foam substrate; and
a radome disposed adjacent the radiating elements,
wherein
the thermally conductive foam substrate and the radome present a triangular shape when viewed in plan view and comprises at least one edge that presents a sawtooth pattern; and
the plurality of radiating elements are arranged in a triangular array on the foam substrate.
2. The antenna subarray of claim 1 , further comprising:
a printed wiring board bonded to the thermally conductive foam substrate, wherein the printed wiring board presents a triangular shape when viewed in plan view and comprises at least one edge that presents a sawtooth pattern;
a triangular array of amplifiers disposed adjacent the printed wiring board.
3. The antenna subarray of claim 2 , further comprising a heat sink module disposed adjacent the triangular array of amplifiers.
4. The antenna subarray of claim 3 , wherein:
the triangular array of amplifiers comprises an array of monolithic microwave integrated circuits (MMICs); and
the heat sink module comprises a phase change material.
5. The antenna subarray of claim 4 , further comprising a static dissipative adhesive layer disposed on the foam substrate and in contact with the radiating elements and which bonds the radome to the substrate, wherein the printed adhesive layer presents a triangular shape when viewed in plan view and comprises at least one edge that presents a sawtooth pattern.
6. The antenna subarray of claim 1 , wherein the thermally conductive foam substrate and the radome present two edges which are smooth.
7. The antenna subarray of claim 2 , wherein said static dissipative adhesive comprises an adhesive material doped with polyaniline.
8. The antenna subarray of claim 7 , wherein the static dissipative adhesive comprises one of polyurethane, epoxy, and Cyanate ester.
9. A phased array antenna assembly comprising a plurality of panels, each panel comprising a plurality of antenna subarray assemblies, at least one of the subarray assemblies comprising:
a thermally conductive foam substrate;
a plurality of radiating elements bonded to the foam substrate; and
a radome disposed adjacent the radiating elements,
wherein
the thermally conductive foam substrate and the radome present a triangular shape when viewed in plan view and comprises at least one edge that presents a sawtooth pattern; and
the plurality of radiating elements are arranged in a triangular array on the foam substrate.
10. The phased array antenna assembly of claim 9 , further comprising:
a printed wiring board bonded to the thermally conductive foam substrate, wherein the printed wiring board presents a triangular shape when viewed in plan view and comprises at least one edge that presents a sawtooth pattern;
a triangular array of amplifiers disposed adjacent the printed wiring board.
11. The phased array antenna assembly of claim 10 , further comprising a heat sink module disposed adjacent the triangular array of amplifiers.
12. The phased array antenna assembly of claim 11 , wherein:
the triangular array of amplifiers comprises an array of monolithic microwave integrated circuits (MMICs); and
the heat sink module comprises a phase change material.
13. The phased array antenna assembly of claim 12 , further comprising a static dissipative adhesive layer disposed on the foam substrate and in contact with the radiating elements and which bonds the radome to the substrate, wherein the printed adhesive layer presents a triangular shape when viewed in plan view and comprises at least one edge that presents a sawtooth pattern.
14. The phased array antenna assembly of claim 9 , wherein the thermally conductive foam substrate and the radome present two edges which are smooth.
15. The phased array antenna assembly of claim 10 , wherein said static dissipative adhesive comprises an adhesive material doped with polyaniline.
16. The phased array antenna assembly of claim 15 , wherein the static dissipative adhesive comprises one of polyurethane, epoxy, and Cyanate ester.
17. A vehicle, comprising:
a communication system; and
a phased array antenna assembly coupled to the communication system and comprising a plurality of panels, each panel comprising a plurality of antenna subarray assemblies, at least one of the subarray assemblies comprising:
a thermally conductive foam substrate;
a plurality of radiating elements bonded to the foam substrate; and
a radome disposed adjacent the radiating elements,
wherein
the thermally conductive foam substrate and the radome present a triangular shape when viewed in plan view and comprises at least one edge that presents a sawtooth pattern; and
the plurality of radiating elements are arranged in a triangular array on the foam substrate.
18. The vehicle of claim 17 , further comprising:
a printed wiring board bonded to the thermally conductive foam substrate;
a triangular array of amplifiers disposed adjacent the printed wiring board.
19. The vehicle of claim 18 , further comprising a heat sink module disposed adjacent the triangular array of amplifiers.
20. The vehicle of claim 19 , wherein:
the triangular array of amplifiers comprises an array of monolithic microwave integrated circuits (MMICs); and
the heat sink module comprises a phase change material.