Wiring substrate and method of manufacturing the same
A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.
1. A wiring substrate, comprising:
a first insulating layer constituting a surface of the wiring substrate, and exhibiting a black color or a gray color;
a first connection pad formed to be exposed from the surface of the wiring substrate, and buried in the first insulating layer, and the first connection pad having a side face and back face covered with the first insulating layer;
a second insulating layer constituting a reverse surface of the wiring substrate, and exhibiting a black color or a gray color;
a second connection pad formed to be exposed from the reverse surface of the wiring substrate, and buried in the second insulating layer, and the second connection pad having a side face and back face covered with the second insulating layer; and
a connection hole formed in the second insulating layer, and exposing the face of the second connection pad, located to the reverse surface side of the wiring substrate,
wherein the connection hole has a side wall surface formed like a curved surface, and has a shape in which an area of the opening portion which is opened to the outer surface of the second insulating layer is formed larger than an area of the bottom surface of the connection hole.
2. A wiring substrate according to claim 1 , wherein the wiring substrate has no core substrate, and an outer surface of the first connection pad is exposed from an outer surface of the first insulating layer, and a side surface and an opposite surface of the outer surface of the first connection pad contact the first insulating layer.
3. A wiring substrate according to claim 2 , wherein the second insulating layer includes a glass cloth.
4. A wiring substrate according to claim 1 , wherein one of the first connection pad and the second connection pad is a chip connection pad for flip-chip connecting a semiconductor chip, and another is an external connection pad for connecting an external connection terminal, and an arrangement pitch of the chip connection pad is narrower than an alignment pitch of the external connection pad.
5. A wiring substrate according to claim 1 , wherein the second insulating layer is formed of a glass cloth impregnated with a black resin.
6. A wiring substrate comprising:
a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color;
a first connection pad formed to be exposed from the first insulating layer;
a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color; and
a second connection pad formed to be exposed from the second insulating layer;
wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole; and
wherein a concave portion is provided in the second connection pad on the bottom part of the connection hole, and the side wall surface of the connection hole and a side surface of the concave portion of the second connection pad constitute a continuous identical surface.
7. A wiring substrate according to claim 6 , wherein the wiring substrate has no core substrate, and an outer surface of the first connection pad is exposed from an outer surface of the first insulating layer, and a side surface and an opposite surface of the outer surface of the first connection pad contact the first insulating layer.
8. A wiring substrate according to claim 7 , wherein the second insulating layer includes a glass cloth.
9. A wiring substrate according to claim 6 , wherein one of the first connection pad and the second connection pad is a chip connection pad for flip-chip connecting a semiconductor chip, and another is an external connection pad for connecting an external connection terminal, and an arrangement pitch of the chip connection pad is narrower than an alignment pitch of the external connection pad.
10. A wiring substrate according to claim 6 , wherein the second insulating layer is formed of the glass cloth impregnated with the black resin.