Method for manufacturing liquid crystal display device
In a method of manufacturing a liquid crystal display device in which a plurality of pixels are arranged in a matrix, each of the pixels has an insulator wall structure at a boundary of the pixels, and a wall electrode is provided at least at a side of the wall structure, the wall structure being formed by: using a chemically amplified resist as a material of the wall structure, a step of applying the chemically amplified resist; a step of exposing and developing the chemically amplified resist; a step of irradiating light on an entire surface to perform post exposure; a step of pre-calcinating the chemically amplified resist at a temperature lower than a main calcination temperature; and a step of performing main calcination at a temperature higher than a pre-calcination temperature.
1. A method for manufacturing a liquid crystal display device in which a plurality of pixels are arranged in a matrix, each of the pixels has an insulator wall structure at a boundary of the pixels, and a wall electrode is provided at least at a side of the wall structure, the wall structure being formed by:
using a chemically amplified resist as a material of the wall structure,
a step of applying the chemically amplified resist; and
a step of exposing and developing the chemically amplified resist.
2. The method for manufacturing a liquid crystal display device according to claim 1 , wherein a positive resist is used as the chemically amplified resist.
3. The method for manufacturing a liquid crystal display device according to claim 1 , further comprising, after the exposing and developing of the chemically amplified resist, the steps of:
post-exposing a remaining chemically amplified resist by irradiating light on entire remaining chemically amplified resist;
pre-calcinating the chemically amplified resist at a temperature lower than a main calcination temperature; and
performing a main calcination at a temperature higher than a pre-calcination temperature.
4. The method for manufacturing a liquid crystal display device according to claim 3 , wherein the pre-calcination temperature is 150° C. or lower and the main calcination temperature is 200° C. or higher.
5. The method for manufacturing a liquid crystal display device according to claim 4 , wherein the pre-calcination temperature is 80 to 120° C., which is equal to or lower than a glass transition temperature of a resist material, and the main calcination temperature is 200 to 250° C. at which a hardening reaction proceeds.
6. The method for manufacturing a liquid crystal display device according to claim 1 , wherein a tapered angle of the formed wall structure is equal to or larger than 70 degrees and smaller than 90 degrees.
7. The method for manufacturing a liquid crystal display device according to claim 1 , wherein an insulating and planarizing film is further formed by:
using a positive resist as a material of the insulating and planarizing film provided between the wall structures,
a step of applying the positive resist;
a step of exposing and developing the positive resist; and
a step of performing main calcination on the positive resist.
8. The method for manufacturing a liquid crystal display device according to claim 7 , wherein a chemically amplified positive resist is used as the positive resist.
9. The method for manufacturing a liquid crystal display device according to claim 8 , wherein as the performing of the main calcination, the main calcination is performed at 200° C. or higher.
10. The method for manufacturing a liquid crystal display device according to claim 8 , wherein the main calcination is performed at a rate of temperature increase of 5° C. or higher.
11. The method for manufacturing a liquid crystal display device according to claim 8 , wherein the main calcination is performed at a rate of temperature increase of 10° C. or higher.
12. The method for manufacturing a liquid crystal display device according to claim 8 , wherein the same material is used for both a resist material of the wall structure and a resist material of the insulating and planarizing film.
13. The method for manufacturing a liquid crystal display device according to claim 7 , wherein when the resist is exposed, the resist is exposed by a mask having an opening which is equal to or larger than a horizontal width of an apex of the wall.