Lithographic apparatus and device manufacturing method
A lithography apparatus includes a projection system configured to project a radiation beam onto a substrate, a detector configured to inspect the substrate, and a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector. The detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.
1. A lithography apparatus comprising:
a projection system comprising a plurality of projection optics arranged in a direction across a substrate, each of the projection optics for projecting a radiation beam onto a substrate;
a detector unit for inspecting the substrate comprising a plurality of detectors arranged in the direction such that each detector in the plurality of detectors is aligned with an associated projection optic in the plurality of projection optics; and
a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector unit;
wherein each detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam projected by the associated projection optic.
2. The apparatus of claim 1 , wherein the plurality of detectors are arranged to simultaneously inspect a plurality of portions of the substrate across the full width of the substrate.
3. The apparatus of claim I, further comprising a controller for adjusting exposure conditions based on said inspecting.
4. The apparatus of claim 1 , wherein the apparatus is configured to provide a patterned beam using an array of individually controllable elements.
5. The apparatus of claim 4 , wherein the apparatus comprises a plurality of arrays of individually controllable elements.
6. A device manufacturing method comprising:
moving a substrate relative to a projection system comprising a plurality of projection optics arranged in a direction across the substrate and a detector unit comprising a plurality of detectors arranged in the direction such that each detector in the plurality of detector is aligned with an associated projection optic in the plurality of projection optics;
inspecting a portion of the substrate using each of the detectors; and
exposing the portion of the substrate using each of the associated projection optics while the exposure conditions are adjusted according to the inspection.
7. The method of claim 6 , wherein the inspecting and the exposing occurs while moving the substrate.
8. The method of claim 6 , wherein moving the substrate relative to the projection system and the detector unit occurs between consecutive exposures.
9. The method of claim 6 , wherein moving the substrate relative to the projection system and the detector unit occurs during continuous exposure.
10. The method of claim 6 , wherein the portion of the substrate being inspected subsequently becomes the portion of the substrate being exposed.
11. The method of claim 6 , wherein the exposure conditions are adjusted to optimize for overlay accuracy.
12. The method of claim 6 , wherein the substrate moves at a substantially constant velocity relative to the projection system and the detector unit.
13. The method of claim 6 , wherein the position of the detectors relative to the projection system is substantially fixed and known.
14. The method of claim 6 , further comprising monitoring the position of the detectors relative to the projection system during exposure.
15. The method of daub 6 , wherein the portion of the substrate comprises the full width of the substrate.