IP Library Granted Patent US 8,678,075
Granted Patent B2
US 8,678,075 · App. 12/628,331 · Granted Mar 25, 2014

Heat exchangers and related methods

Inventors: Evelyn N. Wang (Cambridge, MA); John G. Brisson (Rockport, MA); Stuart A. Jacobson (Lexington, MA); Jeffrey H. Lang (Sudbury, MA); Matthew McCarthy (Arlington, MA)
Assignee: Massachusetts Institute of Technology
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,678,075
App. No.
12/628,331
Granted
Mar 25, 2014
Kind
B2
Abstract

Heat exchanger. The heat exchanger includes a thermal contact plate defining a cavity in fluid communication with a first pipe and a plurality of stationary elements substantially perpendicular to the first pipe each defining a cavity wherein each cavity is in fluid communication with the first pipe and at least one cavity includes a wick. A plurality of movable elements are provided wherein the movable elements and the stationary elements are substantially parallel, alternatingly arranged and a portion of the movable elements overlaps a portion of the stationary elements. A working fluid is provided in the first pipe and cavities or stationary elements and thermal contact plate.

Claims (18)

1. A device comprising:

a thermal contact plate defining a cavity in fluid communication with first and second pipes;

a plurality of stationary elements substantially perpendicular to the first pipe that carries predominantly vaporized working fluid, each stationary element defining a cavity, wherein each cavity is in fluid communication with the first pipe, and at least one cavity comprises a wick;

a second pipe in fluid communication with the cavities in the stationary elements that carries predominantly liquid working fluid back to the thermal contact plate cavity wherein the wick is also located throughout the second pipe, and not located in the first pipe;

a plurality of movable elements, wherein the moveable elements and the stationary elements are substantially parallel, alternatingly arranged, and a portion of the movable elements overlaps a portion of the stationary elements; and

a working fluid in the first and second pipes and cavities, or in the stationary elements and thermal contact plate.

2. The device of claim 1 , wherein the wick comprises sintered particles.

3. The device of claim 1 , wherein the wick comprises a series of pillars with a height in the range of approximately 10 μm to approximately 100 μm, a width in the range of approximately 500 nm to approximately 50 μm and a length in the range of approximately 500 nm to approximately 50 μm and a pitch in the range of approximately 500 nm to approximately 50 μm.

4. The device of claim 1 , having a total volume of not more than about 64 cubic inches.

5. The device of claim 1 , having overall dimensions in the range of about 5 cm to about 10 cm, by about 5 cm to about 10 cm, by about 5 cm to about 10 cm.

6. The device of claim 1 , wherein the stationary element, movable element, thermal contact plate, or heat pipe comprises a material selected from the group consisting of copper, aluminum, silicon, graphite, steel, stainless steel, titanium, diamond, silver, graphene, alloys thereof and combinations thereof.

7. The device of claim 1 , wherein the working fluid is selected from the group consisting of water, ammonia, methanol, ethanol, and combinations thereof.

8. The device of claim 1 , wherein the working fluid has a vaporization temperature in the range of from approximately 40° C. to approximately 150° C.

9. The device of claim 1 wherein the stationary element and associated pipe sections are constructed from a monoblock.

10. The device of claim 1 , wherein the pipe has a diameter of less than about 1 mm.

11. The device of claim 1 , wherein the pipe has a diameter of less than about 5 mm.

12. The device of claim 1 , having an overall thermal resistivity less than about 0.5 K/W.

13. The device of claim 1 , wherein the device can dissipate between about 0.25 kW to about 1 kW of heat.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF ONE OF THE ASSIGNORS SHOULD BE STUART A. JACOBSON PREVIOUSLY RECORDED ON REEL 023841 FRAME 0238. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 12, 2010
From: WANG, EVELYN N.; BRISSON, JOHN G.; JACOBSON, STUART A.; LANG, JEFFREY H.; MCCARTHY, MATTHEW
To: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
Reel/Frame 023932/0523 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2010
From: WANG, EVELYN N.; BRISSON, JOHN G.; JACOBSON, STEWART A.; LANG, JEFFREY H.; MCCARTHY, MATTHEW
To: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
Reel/Frame 023841/0837 →
Continuity (2)
Provisional Application 61142722 · Jan 6, 2009
Related Publication 20100170660A1 · Jul 8, 2010