IP Library Granted Patent US 8,678,549
Granted Patent B2
US 8,678,549 · App. 13/850,052 · Granted Mar 25, 2014

Printhead integrated circuit having frontside inlet channels and backside ink supply channels

Inventors: Kia Silverbrook (Balmain, AU); Akira Nakazawa (Balmain, AU); Christopher Hibbard (Balmain, AU); Paul Ian Mackey (Balmain, AU); Norman Michael Berry (Balmain, AU); Garry Raymond Jackson (Balmain, AU)
Assignee: Zamtec Ltd
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Quick Facts
Patent No.
US 8,678,549
App. No.
13/850,052
Granted
Mar 25, 2014
Kind
B2
Abstract

A printhead integrated circuit includes: an elongate silicon substrate having a frontside and a backside; a row of nozzle chambers disposed at the frontside of the substrate, each nozzle chamber having a respective nozzle opening defined in a roof thereof and a respective inlet defined in a floor thereof; a row of inlet channels defined in the substrate, each inlet channel having a first end defining the inlet of a respective nozzle chamber and an opposite second end; and an ink supply channel defined in the backside of the substrate, each ink supply channel having a depth sufficient to meet with the second ends the inlet channels. Each ink supply channel is elongate and extends longitudinally along a length of the substrate so as to provide fluidic communication between the backside and the nozzle chambers.

Claims (13)

1. An inkjet printhead assembly comprising:

an elongate ink manifold having first and second opposite faces, the first face having a plurality of ink feed channels extending longitudinally therealong, the second face having plurality of rows of outlets, each outlet being in fluid communication with a respective one of the ink feed channels, at least some of said outlets being defined by terminal portions of surface channels defined in the second face, the surface channels extending transversely across the second face;

an adhesive film bonded to the second face of the ink manifold so as to cover the surface channels, the adhesive film defining a plurality of openings, each opening being aligned with a respective one of the outlets to provide an ink path through the adhesive film; and

one or more printhead integrated circuits bonded to the adhesive film, each printhead integrated circuit comprising:

an elongate silicon substrate having a frontside and a backside, the backside being bonded to the adhesive film;

a plurality of rows of nozzle chambers disposed at the frontside of the substrate, each row comprising a plurality of nozzle chambers, each nozzle chamber having a respective nozzle opening defined in a roof thereof and a respective inlet

a plurality of ink supply channels defined in the backside of the substrate, each

ink supply channel extend longitudinally along the backside of the substrate, each ink supply channel being aligned with one row of said outlets, each ink supply channel providing fluidic communication between said row of outlets and at least one row of nozzle chambers.

2. The printhead assembly of claim 1 , wherein each nozzle chamber has a corresponding inlet channel extending from the nozzle chamber through the substrate to a respective ink supply channel, wherein each inlet channel has a first width and the ink supply channel has a second width, the second width being greater than the first width.

3. The printhead assembly of claim 2 , wherein the nozzle chambers are arranged in pairs of rows, each paired row of nozzle chambers extending longitudinally along the frontside and having a corresponding paired row of inlet channels, and wherein each ink supply channel has a width sufficient for supplying ink to a corresponding paired row of inlet channels.

4. The printhead assembly of claim 1 , wherein each ink supply channel has an aspect ratio of less than 3:1, the aspect ratio being defined by the ratio of a channel depth to a channel width.

5. The printhead assembly of claim 1 comprising drive circuitry disposed at the frontside of the substrate and a passivation layer disposed on the drive circuitry, wherein the nozzle chambers are disposed on the passivation layer.

6. The printhead assembly of claim 5 , wherein each nozzle chamber comprises an actuator electrically connected to the drive circuitry.

Assignments (4)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2014
From: SILVERBROOK, KIA; NAKAZAWA, AKIRA; HIBBARD, CHRISTOPHER; MACKEY, PAUL IAN; BERRY, NORMAN MICHEAL; JACKSON, GARRY RAYMOND
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 032560/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2014
From: SILVERBROOK RESEARCH PTY LTD
To: ZAMTEC LIMITED
Reel/Frame 032560/0539 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2014
From: SILVERBROOK RESEARCH PTY. LIMITED
To: ZAMTEC LIMITED
Reel/Frame 032046/0274 →
Continuity (6)
Continuation 12786346 · May 24, 2010
Continuation 12206740 · Sep 9, 2008
Continuation 11097268 · Apr 4, 2005
Continuation In Part 11014769 · Dec 20, 2004
Continuation In Part 10760254 · Jan 21, 2004
Related Publication 20130215199A1 · Aug 22, 2013