Method of manufacturing electric device, array of electric devices, and manufacturing method therefor

1. A method of manufacturing an array of electric devices, comprising:

attaching a platform including a micro-channel structure to a substrate;

injecting a first solution and a second solution into the micro-channel structure to form at least three liquid film columns on the substrate,

the first solution and the second solution each, respectfully, including a different solvent composition ratio, and

the liquid film columns each, respectfully, including a different solvent composition ratio;

removing solvent from the liquid film columns to form thin film columns;

detaching the platform from the substrate; and

treating the thin film columns under different conditions along a length direction of the thin film columns.

2. The method of claim 1 , wherein

the thin film columns include at least one organic semiconductor, and

the method further includes connecting a plurality of electrodes to the thin film columns.

3. The method of claim 2 , wherein the treating the thin film columns comprises:

annealing the thin film columns.

4. The method of claim 3 , wherein the annealing the thin film columns comprises a process that varies an annealing temperature along a length direction of the thin film columns, the process including:

contacting a first end of the substrate to a hot plate, and exposing a second end of the substrate to a temperature lower than a temperature of the hot plate,

the second end opposite the first end.

5. The method of claim 4 , wherein

the plurality of electrodes include a source electrode and a drain electrode,

the source electrode disposed opposite the drain electrode relative to a length direction of the thin film columns.

6. The method of claim 5 , wherein

the first solution and the second solution include the at least one organic semiconductor in common,

the first solution further includes a first solvent, and

the second solution further comprises a second solvent.

7. The method of claim 6 , wherein

the at least one organic semiconductor includes poly(didodecylquaterthiophene-alt-didodecylbithiazole),

the first solvent includes chlorobenzene, and the second solvent includes chloroform.

8. The method of claim 4 , wherein

the plurality of electrodes includes a plurality of pairs of upper electrodes and lower electrodes,

the upper electrodes are disposed on the thin film columns, and

the lower electrodes are disposed between the thin film columns and the substrate.

9. The method of claim 8 , wherein

the at least one organic semiconductor includes a p-type organic semiconductor and an n-type organic semiconductor,

the first solution and the second solution include a solvent in common, the first solution includes the p-type organic semiconductor, and

the second solution includes the n-type organic semiconductor.

10. The method of claim 9 , wherein

the p-type organic semiconductor includes at least one of pentacene, copper phthalocyanine (CuPc), tetracyanoquinodimethane (TCNQ), 6,13-bis(triisopropylsilylethynyl) (TIPS) pentacene, poly(3-hexylthiophene) (P3HT), poly-phenylene vinylene (PPV), and poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] (PBTTT);

the n-type organic semiconductor includes at least one of phenyl-C61-butyric acid methyl ester (PCBM), C60, and perylenediimide (PDI) derivatives; and

the solvent includes at least one of chlorobenzene, chloroform, toluene, benzene, tetrahydrofuran (THF), CCl 4 , methylenechloride, and ethylacetate.

11. A method of manufacturing an organic electric device, comprising:

selecting a solvent and a solute,

forming a organic semiconductor thin film on a first substrate by a solution process using the selected solvent and a solute; and

forming a pair of first electrodes contacting the thin film,

wherein the selection comprises:

attaching a platform including a micro-channel structure to a second substrate,

injecting a first solution and a second solution into the micro-channel structure to form at least three liquid film columns,

the first solution and the second solution each, respectfully, including a different solvent composition ratio, and

the liquid film columns each, respectfully, including a different solvent composition ratio,

removing the solvent from the liquid film columns to form thin film columns,

detaching the platform from the second substrate, and

treating the thin film columns under different conditions along length direction of the thin film columns;

connecting a plurality of second electrodes to the thin film to create test organic electric devices;

testing characteristics of the test organic electric devices; and

selecting the solvent and solute based on the tested characteristics.

12. The method of claim 11 , wherein the treatment of the thin film columns comprises:

annealing the thin film columns under different temperatures along a length direction of the thin film columns.

13. The method of claim 12 , wherein the annealing the thin film columns comprises a process that varies an annealing temperature along a length direction of the thin film columns, the process including:

contacting a first end of the second substrate to a hot plate, and

exposing a second end of the second substrate to a temperature lower than a temperature of the hot plate, the second end opposite the first end.

14. The method of claim 13 , wherein

the plurality of second electrodes include a source electrode and a drain electrode, the source electrode disposed opposite the drain electrode relative to a length direction of the thin film columns.

15. The method of claim 14 , wherein

the first solution and the second solution include the at least one organic semiconductor in common,

the first solution further includes a first solvent, and the second solution further includes a second solvent.

16. The method of claim 15 , wherein

the at least one organic semiconductor includes poly(didodecylquaterthiophene-alt-didodecylbithiazole),

the first solvent includes chlorobenzene, and

the second solvent includes chloroform.

17. The method of claim 13 , wherein

the plurality of second electrodes include a plurality of pairs of upper electrodes and lower electrodes,

the upper electrodes are disposed on the thin film columns, and

the plurality of lower electrodes are disposed between the thin film columns and the second substrate.

18. The method of claim 17 , wherein

the first solution and the second solution include a solvent in common,

the first solution further includes a p-type organic semiconductor as a solute, and

the second solution further includes a n-type organic semiconductor as a solute.

19. The method of claim 18 , wherein

the p-type organic semiconductor includes at least one of pentacene, copper phthalocyanine (CuPc), tetracyanoquinodimethane (TCNQ), 6,13-bis(triisopropylsilylethynyl) (TIPS) pentacene, poly(3-hexylthiophene) (P3HT), poly-phenylene vinylene (PPV), and poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] (PBTTT);

the n-type organic semiconductor includes at least one of phenyl-C61-butyric acid methyl ester (PCBM), C60, and perylenediimide (PDI) derivatives; and

the solvent includes at least one of chlorobenzene, chloroform, toluene, benzene, tetrahydrofuran (THF), CCl 4 , methylenechloride, and ethylacetate.