IP Library Granted Patent US 8,691,619
Granted Patent B2
US 8,691,619 · App. 12/743,686 · Granted Apr 8, 2014

Laminated structure for CIS based solar cell, and integrated structure and manufacturing method for CIS based thin-film solar cell

Inventors: Hideki Hakuma (Tokyo, JP); Katsuya Tabuchi (Tokyo, JP); Yosuke Fujiwara (Tokyo, JP); Katsumi Kushiya (Tokyo, JP)
Assignee: Showa Shell Sekiyu, K.K.
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Quick Facts
Patent No.
US 8,691,619
App. No.
12/743,686
Granted
Apr 8, 2014
Kind
B2
Abstract

This invention aims to provide a laminated structure and an integrated structure of a high production efficiency for a CIS based thin-film solar cell, which can produce a high-resistance buffer layer of the CIS based thin-film solar cell efficiently on a series of production lines and which needs no treatment of wastes or the like, and a manufacturing method for the structures. The CIS based thin-film solar cell includes a back electrode, a p-type CIS based light absorbing layer, a high-resistance buffer layer and an n-type transparent conductive film laminated in this order. The high-resistance buffer layer and the n-type transparent conductive film are formed of thin films of a zinc oxide group. The buffer layer contacts the p-type CIS based light absorbing layer directly, and has a resistivity of 500Ω·cm or higher.

Claims (11)

1. A method for manufacturing a CIS based thin-film solar cell, comprising the steps of:

making a back electrode on a substrate selected from the group consisting of glass and metal;

forming a p-type CIS based light absorbing layer on the back electrode;

forming a buffer layer formed of a thin film of a zinc oxide group directly on the p-type CIS based light absorbing layer; and

forming an n-type transparent conductive film formed of the thin film of a zinc oxide group on the buffer layer,

wherein the buffer layer forming step is performed by an MOCVD method, and

a substrate temperature of the buffer layer forming step is 190 to 300° C. which is higher than the substrate temperature at the time of forming the n-type transparent conductive film for keeping a high resistivity of the buffer layer which is 500Ω·cm or higher by avoiding diffusion of dopant from the n-type transparent conductive film to the buffer layer.

2. The method for manufacturing a CIS based thin-film solar cell according to claim 1 , wherein the n-type transparent conductive film is formed by the MOCVD method.

3. The method for manufacturing a CIS based thin-film solar cell according to claim 1 , wherein a film forming rate of the buffer layer is 15 nm per minute or higher.

4. The method for manufacturing a CIS based thin-film solar cell according to claim 1 ,

the n-type transparent conductive film is an electrode and contains dopant.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2014
From: SHOWA SHELL SEKIYU K.K.
To: SOLAR FRONTIER K.K.
Reel/Frame 034382/0537 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2010
From: HAKUMA, HIDEKI; TABUCHI, KATSUYA; FUJIWARA, YOSUKE; KUSHIYA, KATSUMI
To: SHOWA SHELL SEKIYU K.K.
Reel/Frame 024409/0627 →
Priority Claims (1)
JP 2007-311540 · Nov 30, 2007 · national
Continuity (1)
Related Publication 20100267190A1 · Oct 21, 2010