Method and apparatus for removing heat from electronic devices using synthetic jets
An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.
1. An apparatus for removing heat, comprising:
a heat sink having a cavity; and
a synthetic jet stack comprising at least one synthetic jet mounted within the cavity using at least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod, wherein the synthetic jet comprises at least one orifice through which a fluid is ejected;
wherein the synthetic jet stack further comprises
at least one arm extending from the at least one synthetic jet, the at least one arm comprising a hole;
wherein the at least one rod is releasably secured within the cavity of the heat sink to provide a rigid support to the at least one arm; and
wherein the at least one rod is configured to be inserted through the hole, and wherein the at least one rod is configured to provide a rigid support to the at least one synthetic jet.
2. The apparatus of claim 1 , wherein the at least one synthetic jet comprises at least two synthetic jets, and wherein the stack further comprises the at least one engaging structure for providing a separation between the at least two synthetic jets, and/or the at least one synthetic jet and the heat sink.
3. The apparatus of claim 1 , wherein each of the at least one rod is oriented to be positioned out of phase with respect to each of the at least one orifice, such that the at least one rod does not obstruct the at least one orifice.
4. The apparatus of claim 3 , wherein the at least one rod comprises a plurality of rods.
5. The apparatus of claim 4 , wherein the at least one orifice comprises a plurality of orifices.
6. The apparatus of claim 1 , wherein the at least one rod is screwed into the heat sink.
7. The apparatus of claim 1 , wherein the at least one rod is secured to a base of the heat sink.
8. The apparatus of claim 1 , wherein the synthetic jet further comprises
a first piezoelectric disk and a second piezoelectric disk, each disk configured to vibrate upon incidence of electricity; and
a wall positioned between the first piezoelectric disk and the second piezoelectric disk, wherein the wall further comprises the at least one orifice.
9. The apparatus of claim 8 , wherein the at least one arm extends from the wall.
10. The apparatus of claim 9 , wherein the wall is positioned to remain substantially within the periphery of the first piezoelectric disk and the second piezoelectric disk.
11. The apparatus of claim 9 , wherein the wall is positioned to protrude horizontally outwards from the periphery of the first piezoelectric disk and the second piezoelectric disk.
12. The apparatus of claim 9 , wherein the wall is positioned to protrude vertically outward from the periphery of the first piezoelectric disk and the second piezoelectric disk.
13. The apparatus of claim 8 , wherein the wall comprises an elastomeric material.
14. The apparatus of claim 1 , wherein the at least one arm comprises a low modulus elastomeric material.
15. The apparatus of claim 1 , wherein the engaging structure comprises at least one of a spacer, a clip, a latch, a click-fit notch, and an adhesive bond.
16. The apparatus of claim 15 , wherein the at least one engaging structure comprises a spacer slidable over the at least one rod configured to provide a separation between the at least two synthetic jets, and/or the at least one synthetic jet and the heat sink.