IP Library › Granted Patent US 8,700,810
Granted Patent B2
US 8,700,810 · App. 12/718,138 · Granted Apr 15, 2014

Semiconductor devices capable of dividing endpoint into majority of sub-endpoints

Inventors: Sung Geun Park (Gyeonggi-do, KR); Chul Joon Choi (Gyeonggi-do, KR); Keon Han Sohn (Gyeonggi-do, KR)
Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,700,810
App. No.
12/718,138
Granted
Apr 15, 2014
Kind
B2
Abstract

A semiconductor device includes at least one endpoint communicating with a host, and an endpoint controller dividing each of the at least one endpoint into a majority of sub-endpoints and performing numbering to each of the divided sub-endpoints. The endpoint controller transmits a packet generated by the host to any one of the sub-endpoints.

Claims (19)

1. A semiconductor device comprising:

at least one endpoint that is configured to communicate with a host; and

an endpoint controller that is configured to divide each of the at least one endpoints into a majority of sub-endpoints and to number each of the divided sub-endpoints,

wherein the endpoint controller is further configured to transmit a packet generated by the host to any one of the sub-endpoints,

wherein the endpoint controller generates a negative acknowledgement (NAK) handshake when the sub-endpoint is not able to receive the packet, and

wherein the endpoint controller is configured to divide the at least one endpoint into first and second sub-endpoints, and to control a destination of the packet to be the first sub-endpoint or the second sub-endpoint in response to the packet corresponding to the at least one endpoint being received from the host;

wherein the endpoint controller receives a number of an endpoint, to which the host desires to transmit the packet, of the at least one endpoint, and transmits the packet to any one of the sub-endpoints corresponding to the received endpoint number.

2. The semiconductor device of claim 1 , wherein the endpoint controller generates an acknowledgement (ACK) handshake in response to the first sub-endpoint or the second sub-endpoint completely receiving the packet.

3. The semiconductor device of claim 2 , wherein the endpoint controller controls a destination of a second packet corresponding to the at least one endpoint to be the second sub-endpoint in response to the first sub-endpoint completely receiving a first packet received from the host.

4. The semiconductor device of claim 3 , wherein the endpoint controller generates the negative acknowledgement (NAK) handshake in response to the first sub-endpoint receiving the second packet substantially at completion of the receiving of the first packet.

5. The semiconductor device of claim 1 ,

wherein the device is operated in a first mode in which the endpoint receives a first packet transmitted by the host;

wherein the device is operated in a second mode in which the endpoint transmits a second packet to the host, and

wherein the endpoint controller changes the mode of the first sub-endpoint receiving the first packet, from the first mode to the second mode, in response to the operation of the first mode being completed, and the mode of the second sub-endpoint transmitting the second packet, to the first mode, in response to the operation of the second mode being completed.

6. The semiconductor device of claim 5 , wherein the endpoint controller generates the negative acknowledgement (NAK) handshake in response to the host requesting a change to the second mode before the first sub-endpoint is changed from the first mode to the second mode.

7. The semiconductor device of claim 1 , wherein the endpoint controller comprises:

a numbering unit that is configured to divide each of the at least one endpoints into a majority of sub-endpoints and to number each of the divided sub-endpoints; and

a negative acknowledgement (NAK) transmission unit that is configured to generate a NAK handshake in response to the sub-endpoint numbered by the numbering unit not being able to receive the packet generated by the host.

8. The semiconductor device of claim 1 , the device comprising a universal serial bus (USB) device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2010
From: PARK, SUNG GEUN; CHOI, CHUL JOON; SOHN, KEON HAN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 024034/0449 →
Priority Claims (1)
KR 10-2009-0018847 · Mar 5, 2009 · national
Continuity (1)
Related Publication 20100228896A1 · Sep 9, 2010