Semiconductor device and manufacturing method
View Patent ↗The method of the present invention comprises forming a word line crossing with an active region on a semiconductor substrate; forming a diffusion layer region; forming a first insulating film as high as a bit line to be formed; etching the first insulating film, while using, as a mask, a pattern having a linear aperture extending to the active region on the first insulating film so as to form a groove pattern for exposing the surface of the semiconductor substrate; embedding a conductive film in the groove pattern; forming a mask pattern passing over a portion, in which a bit contact is formed, on the first insulating film; and removing the first insulating film and the conductive layer until the upper layer insulating film of the word line is exposed, while using the mask pattern as a mask so as to isolate a bit contact from another contact.
1. A semiconductor device comprising on a substrate:
at least three line patterns A arranged in parallel each other; and
line patterns B disposed in gaps of the at least three line patterns A;
wherein the line patterns B comprise a first insulating film and a conductive film dividing the first insulating film in a direction extending the line pattern B, and
wherein the line patterns B comprise a line pattern B1 whose top is located at the same level of the top of the line patterns A and a line pattern B2 whose top is located at the higher level than the top of the line patterns A.
2. The semiconductor device according to claim 1 , further comprising a second insulating film on the line patterns A and the line pattern B1, the second insulating film being in contact with the both sides of the line pattern B2 over the line pattern A, and the top of the second insulating film being located at the same level of the top of the line pattern B2.
3. The semiconductor device according to claim 1 , wherein the conductive layers in the line patterns B are located along with a line extending to a direction not parallel to the line patterns A and B.
4. The semiconductor device according to claim 1 , wherein each of the line patterns B comprises a plurality of the conductive layers that are evenly separated each other by the first insulating film.
5. The semiconductor device according to claim 1 , wherein the conductive film in the line pattern B1 constitutes a contact plug P1 through the first insulating film and the conductive film in the line pattern B2 constitutes a contact plug P2 through the first insulating film.
6. The semiconductor device according to claim 5 , wherein the contact plugs P1 and P2 have a planar shape of a parallelogram in which a pair of opposed sides is parallel to the line patterns A.
7. The semiconductor device according to claim 5 , wherein the line pattern A comprises a conductive layer, an insulating layer on the conductive layer and sidewalls disposed on the sides of a stack of the conductive layer and the insulating layer.
8. The semiconductor device according to claim 5 , wherein the contact plugs P1 and P2 are electrically connected to a diffusion layer disposed on a semiconductor substrate as the substrate.
9. The semiconductor device according to claim 8 , wherein the semiconductor substrate comprises an active region that is extended in a direction not parallel to the line patterns A, two of the line patterns A pass over the active region, three diffusion layers are provided on the active region where no line pattern A passes, the contact plug P2 is electrically connected to one diffusion layer provided between the two line patterns A and the contact plug P1 is electrically connected to each of two remained diffusion layers.
10. The semiconductor device according to claim 9 , further comprising a wiring electrically connected to the top of the contact plug P2.