Flexible organic light emitting device and manufacturing method thereof

1. A flexible organic light emitting device, comprising:

a flexible substrate;

an organic light emitting unit, disposed on the flexible substrate, the organic light emitting unit comprising:

a first electrode layer and a second electrode layer opposing the first electrode layer; and

an organic light emitting layer, disposed between the first electrode layer and the second electrode layer;

a covering substrate having a base film, an adhesion layer and an insulation layer, wherein the adhesion layer is formed on an inner surface of the base film, the insulation layer is formed on the adhesion layer, and the adhesion layer is disposed between the insulation layer and the inner surface of the base film;

wherein the covering substrate is disposed on the flexible substrate, so that the inner surface of the base film faces an inner surface of the flexible substrate, the base film and the flexible substrate form a space therebetween, and the insulation layer is disposed between the base film and the organic light emitting unit;

wherein an adhesive peeling force between the insulation layer and the organic light emitting unit is substantially less 0.1 N/cm, and the adhesion layer covers the insulation layer and the organic light emitting unit and fills the space.

2. The flexible organic light emitting device of claim 1 , wherein an adhesive peeling force between the insulation layer and the second electrode layer is substantially less than 0.1 N/cm.

3. The flexible organic light emitting device of claim 1 , wherein the adhesive peeling force between the insulation layer and the organic light emitting unit is substantially less than an adhesive peeling force between the second electrode layer and the organic light emitting layer.

4. The flexible organic light emitting device of claim 1 , wherein the light emitting unit further comprises an encapsulation layer, the encapsulation layer disposed between the second electrode layer and the insulation layer, wherein an adhesive peeling force between the encapsulation layer and the second electrode layer is substantially greater than an adhesive peeling force between the insulation layer and the encapsulation layer.

5. The flexible organic light emitting device of claim 4 , wherein the adhesive peeling force between the insulation layer and the encapsulation layer is substantially less than 0.1 N/cm.

6. The flexible organic light emitting device of claim 1 , wherein the thickness of the insulation layer is between about 0.01 μm to about 100 μm.

7. The flexible organic light emitting device of claim 1 , wherein the insulation layer is disposed on the organic light emitting unit and covers sides of the organic light emitting unit.

8. The flexible organic light emitting device of claim 1 , wherein the organic light emitting unit and the insulation layer further comprises a gap therebetween.

9. The flexible organic light emitting device of claim 1 , wherein no bonding force is generated between the insulation layer and the organic light emitting unit.

10. A manufacturing method of a flexible organic light emitting device, the manufacturing method comprising:

providing a flexible substrate;

forming an organic light emitting unit on the flexible substrate, wherein the organic light emitting unit comprising:

a first electrode layer and a second electrode layer; and

an organic light emitting layer disposed between the first electrode layer and the second electrode layer; and

providing a covering substrate, the covering substrate comprising a base film an adhesion layer and an insulation layer, wherein the adhesion layer is formed on an inner surface of the base film, the insulation layer is formed on the adhesion layer, and the adhesion layer is disposed between the insulation layer and the inner surface of the base film:

disposing the covering substrate on the flexible substrate, so that the inner surface of the base film faces an inner surface of the flexible substrate, the base film and the flexible substrate form a space therebetween, and the insulation layer is disposed between the base film and the organic light emitting unit,

wherein an adhesive peeling force between the insulation layer and the organic light emitting unit is substantially less 0.1 N/cm,

and the adhesion layer covers the insulation layer and the organic light emitting unit and fills the space.

11. The manufacturing method of claim 10 further comprising forming the flexible substrate on a carrier substrate and separating the flexible substrate and the carrier substrate after the step of providing the covering substrate.

12. The manufacturing method of claim 10 , wherein an adhesive peeling force between the insulation layer and the second electrode layer is substantially less than 0.1 N/cm.

13. The manufacturing method of claim 10 , wherein the adhesive peeling force between the insulation layer and the organic light emitting unit is substantially less than an adhesive peeling force between the second electrode layer and the organic light emitting layer.

14. The manufacturing method of claim 10 further comprising forming an encapsulation layer between the second electrode layer and the insulation layer.

15. The manufacturing method of claim 14 , wherein an adhesive peeling force between the insulation layer and the encapsulation layer is substantially less than 0.1 N/cm.

16. The manufacturing method of claim 10 , wherein the insulation layer and the organic light emitting unit further comprises a gap therebetween.

17. The manufacturing method of claim 10 , wherein no bonding force is generated between the insulation layer and the organic light emitting unit.