Integrated circuit system with distributed power supply comprising interposer and voltage regulator module

1. An integrated circuit system comprising:

an interposer;

a first integrated circuit comprising:

first bond pads, the first integrated circuit die bonded to the interposer on a front surface of the first integrated circuit at a first position of the interposer using the first bond pads;

second bond pads; and

at least two circuit blocks, at least two of the circuit blocks adapted to operate at different operating voltages; and

at least one voltage regulator module die bonded to the second bond pads on the front surface of the first integrated circuit, the at least one voltage regulator module adapted to convert a received power supply voltage to the respective operating voltage of a respective one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads, the at least one voltage regulator module being separate from the interposer, and die bonded to the interposer at a second position of the interposer different from the first position,

wherein the at least one voltage regulator module is connected between the first integrated circuit and the interposer.

2. The integrated circuit system according to claim 1 , the first integrated circuit further comprising a dynamic voltage and frequency scaling controller connected to and adapted to control the at least one voltage regulator module.

3. The integrated circuit system according to claim 1 , further comprising a second integrated circuit die bonded to a back surface of the first integrated circuit, the back surface being opposite to the front surface of the first integrated circuit.

4. The integrated circuit system according to claim 3 , further comprising at least one of a through silicon via or a metal layer, electrically connecting the respective one of the at least two circuit blocks to the second integrated circuit.

5. The integrated circuit system according to claim 1 , the second bond pads electrically connected to the respective one of the at least two circuit blocks, the respective one of the at least two circuit blocks on the front surface of the first integrated circuit.

6. The integrated circuit system according to claim 1 , the second bond pads formed in an area of the first integrated circuit that corresponds to the respective one of the at least two circuit blocks.

7. The integrated circuit system according to claim 1 , the interposer further comprising at least one supply bond pad that is electrically connected to the at least one voltage regulator module.

8. The integrated circuit system according to claim 7 , the interposer further comprising at least one of a redistribution layer or metal layer electrically connecting the at least one supply bond pad to the at least one voltage regulator module.

9. The integrated circuit system according to claim 8 , further comprising a wire bond pad electrically connecting the at least one of the redistribution layer and the metal layer to a power supply configured to supply the power supply voltage.

10. The integrated circuit system according to claim 1 , the at least one voltage regulator module die bonded to the second bond pads on a back surface of the first integrated circuit, a front surface of the first integrated circuit opposite the back surface and die bonded to the interposer.

11. The integrated circuit system according to claim 10 , further comprising a second integrated circuit die bonded to the back surface of the first integrated circuit.

12. The integrated circuit system according to claim 10 , further comprising at least one supply bond pad electrically connecting the at least one voltage regulator module to a power supply that supplies the power supply voltage.

13. The integrated circuit system according to claim 12 , the first integrated circuit further comprising at least one of a redistribution layer or metal layer electrically connecting the at least one supply bond pad to the power supply.

14. The integrated circuit system according to claim 13 , further comprising a wire bond pad electrically connecting the at least one of the redistribution layer and the metal layer to the power supply.

15. The integrated circuit system according to claim 10 , the second bond pads electrically connected to the respective circuit block using at least of a through silicon via or a metal layer.

16. A chip package comprising:

a substrate comprising first bond pads;

an interposer comprising second bond pads, the interposer die bonded to the first bond pads;

a first integrated circuit comprising:

a planar surface, the first integrated circuit die bonded to the second bond pads by the planar surface;

third bond pads on the planar surface; and

at least two circuit blocks, at least two of the circuit blocks adapted to operate at different operating voltages;

at least one voltage regulator, the at least one voltage regulator module die bonded to the third bond pads, the at least one voltage regulator module adapted to supply a respective one of the at least two circuit blocks with the respective operating voltage via the third bond pads, the at least one voltage regulator being separate from the interposer; and

a wire bond, the wire bond adapted to electrically connect the voltage regulator module to a supply bond pad.

17. The integrated circuit system according to claim 16 , the interposer further comprising at least one of a redistribution layer or metal layer electrically connecting the at least one supply bond pad to the at least one voltage regulator module.

18. An integrated circuit system comprising:

an interposer;

a first integrated circuit comprising:

first bond pads, the first integrated circuit die bonded to the interposer on a front surface of the first integrated circuit at a first position of the interposer using the first bond pads;

second bond pads; and

at least two circuit blocks, at least two of the circuit blocks adapted to operate at different operating voltages;

at least one voltage regulator module die bonded to the second bond pads on the front surface of the first integrated circuit, the at least one voltage regulator module adapted to convert a received power supply voltage to the respective operating voltage of a respective one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads, the at least one voltage regulator module being separate from the interposer, and die bonded to the interposer at a second position of the interposer different from the first position; and

a second integrated circuit die bonded to a back surface of the first integrated circuit, the back surface being opposite to the front surface of the first integrated circuit.

19. The integrated circuit system according to claim 18 , further comprising at least one of a through silicon via or a metal layer, electrically connecting the respective one of the at least two circuit blocks to the second integrated circuit.

20. The integrated circuit system according to claim 18 , the interposer further comprising at least one of a redistribution layer or metal layer electrically connecting the at least one supply bond pad to the at least one voltage regulator module.

21. An integrated circuit system comprising:

an interposer;

a first integrated circuit comprising:

first bond pads, the first integrated circuit die bonded to the interposer at a first position of the interposer using the first bond pads;

second bond pads; and

at least two circuit blocks comprising a first circuit block and a second circuit block, the first circuit block and the second circuit block being adapted to operate at different operating voltages;

at least one voltage regulator module die bonded to the second bond pads, the at least one voltage regulator module adapted to convert a received power supply voltage to the respective operating voltage of the first circuit blocks and supply the respective operating voltage via the second bond pads, the at least one voltage regulator module being separate from the interposer, and die bonded to the interposer at a second position of the interposer different from the first position,

wherein the second bond pads are formed in an area of the first circuit block.