IP Library Granted Patent US 8,720,530
Granted Patent B2
US 8,720,530 · App. 11/435,964 · Granted May 13, 2014

Multi-layer wick in loop heat pipe

Inventors: Julie Fatemeh Asfia (Huntington Beach, CA); Qingjun Cai (Thousand Oaks, CA); Chung-Lung Chen (Thousand Oaks, CA)
Assignee: The Boeing Company
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Quick Facts
Patent No.
US 8,720,530
App. No.
11/435,964
Granted
May 13, 2014
Kind
B2
Abstract

In one aspect of the present invention, a multi-layer wick for a loop heat pipe is provided. The multi-layer wick includes a primary wick, the primary wick comprising: a first layer; and a second layer, wherein the first layer surrounds the second layer; and a secondary wick, wherein the second layer of the primary wick surrounds the secondary wick. In another aspect of the present invention, a method of fabricating a multi-layer wick is provided. The method includes machining the outer diameter of an inner layer larger than the inner diameter of an outer layer; heating the outer layer to enlarge the inner diameter; inserting the inner layer into the outer layer; and cooling the inner layer and the outer layer.

Claims (31)

1. A multi-layer wick structure for a loop heat pipe, comprising:

a primary wick including a first layer and a second layer, wherein the first layer made of a first material substantially surrounds a first portion of the second layer, the second layer having a second portion which is not surrounded by the first layer and extends beyond the first layer, the second layer made of a second material having a lower thermal conductivity than the first material; and

a secondary wick made of a third material having a thermal conductivity higher than the second material disposed at least partially within the primary wick.

2. The multi-layer wick of claim 1 , wherein the first material comprises nickel.

3. The multi-layer wick of claim 1 , wherein the second material comprises a ceramic.

4. The multi-layer wick of claim 1 , wherein the multi-layer wick connects a compensation chamber to an evaporator in the loop heat pipe.

5. The multi-layer wick of claim 4 , wherein a portion of the secondary wick is inside the compensation chamber.

6. The multi-layer wick of claim 1 , wherein the primary wick further comprises a third layer, and wherein the second layer of the primary wick is surrounding the third layer of the primary wick.

7. A loop heat pipe comprising:

a compensation chamber;

an evaporator; and

a multi-layer wick connecting the compensation chamber to the evaporator, the multi-layer wick comprising:

a primary wick including a first layer and a second layer, wherein the first layer is made of a first material and surrounds a covered portion of the second layer, the second layer made of a second material having a lower thermal conductivity than the first material, the second layer including an uncovered portion extending a length from the compensation chamber to the covered portion to prevent heat leakage to the compensation chamber; and

a secondary wick made of a third material having a thermal conductivity higher than the second material disposed at least partially within the primary wick.

8. The loop heat pipe of claim 6 , wherein the first and third material comprise nickel and the second material comprises a ceramic.

9. The loop heat pipe of claim 6 , wherein a portion of the secondary wick is inside the compensation chamber.

10. A multi-layer wick structure for a loop heat pipe, comprising:

an elongated primary wick including a first layer made of a first material and a second layer made of a second material, wherein the first layer substantially surrounds at least a portion of the second layer, and wherein the first material has a higher thermal conductivity than the second material.

11. The multi-layer wick structure of claim 10 , wherein the second layer includes a first portion surrounded by the first layer and a second portion not surrounded by the first layer.

12. The multi-layer wick structure of claim 11 , wherein an outer diameter of the wick structure is uniform along a length of the wick structure including a portion thereof corresponding to the second portion of the second layer and a portion thereof corresponding to the first portion of the second layer surrounded by the first layer.

13. The multi-layer wick structure of claim 10 , further comprising a secondary wick extending from the second layer and surrounded at least partially by the second layer.

14. The multi-layer wick structure of claim 13 , wherein the secondary wick is made of a third material having a thermal conductivity higher than the second material.

15. The multi-layer wick structure of claim 1 , wherein:

a pore size of the first layer of the primary wick is between approximately 0.5 μm and 10.0 μm; and

a pore size of the second layer of the primary wick is between approximately 1.0 μm and 15.0 μm.

16. The loop heat pipe of claim 7 , wherein:

a pore size of the first layer of the primary wick is between approximately 0.5 μm and 10.0 μm; and

a pore size of the second layer of the primary wick is between approximately 1.0 μm and 15.0 μm.

17. The multi-layer wick structure of claim 10 , wherein:

a pore size of the first layer is between approximately 0.5 μm and 10.0 μm; and

a pore size of the second layer is between approximately 1.0 μm and 15.0 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2006
From: ASFIA, JULIE F.; CAI, QINGJUN; CHEN, CHUNG-LUNG
To: BOEING COMPANY, THE
Reel/Frame 017902/0622 →
Continuity (1)
Related Publication 20070267180A1 · Nov 22, 2007