IP Library Granted Patent US 8,731,499
Granted Patent B2
US 8,731,499 · App. 13/663,157 · Granted May 20, 2014

On-chip power management for a mobile communication device and method for use therewith

Inventors: Ahmadreza Rofougaran (Newport Coast, CA); Maryam Rofougaran (Rancho Palos Verdes, CA)
Assignee: Broadcom Corporation
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Quick Facts
Patent No.
US 8,731,499
App. No.
13/663,157
Granted
May 20, 2014
Kind
B2
Abstract

A voice data and RF integrated circuit (IC) includes a memory module that stores a least one application as a plurality of operational instructions, the at least one application having a plurality of power modes that each correspond to one of a plurality of use characteristics. A processing module executes the plurality of operational instructions and that determines a selected one of the plurality of power modes based on current use characteristics of the at least one application, and generates a power mode signal based on the selected one of the plurality of power modes. An on-chip power management circuit receives the power mode signal and that generates a plurality of power supply signals based on the power mode signal.

Claims (41)

1. A voice data and RF integrated circuit (IC) comprising:

a processing module, coupled to a memory module, that executes a plurality of operational instructions of at least one application and that determines a selected one of a plurality of power modes based on current use characteristics of the at least one application, and generates a power mode signal based on the selected one of the plurality of power modes; and

a power management circuit, coupled to the processing module, that receives the power mode signal and that generates a plurality of power supply signals based on the power mode signal;

wherein the voice data and RF IC is integrated in a package with a top and a bottom having a plurality of bonding pads to connect the voice data and RF IC to a circuit board, wherein the power management circuit is integrated along the bottom of the package and wherein the bonding pads are arrayed in an area of the bottom with an open center portion and wherein the power management circuit is integrated in the open center portion.

2. The voice data and RF IC of claim 1 further comprising:

a universal serial bus (USB) interface module that can be selectively activated by the processing module based on the current use characteristics and wherein the processing module generates the power mode signal that commands the power management circuit to generate a USB supply voltage.

3. The voice data and RF IC of claim 1 wherein the power management circuit generates an additional supply voltage in response to the power mode signal.

4. The voice data and RF IC of claim 1 wherein the power management circuit adjusts a supply voltage in response to the power mode signal.

5. The voice data and RF IC of claim 1 wherein the power management circuit adjusts a supply current limit in response to the power mode signal.

6. The voice data and RF IC of claim 1 further comprising:

an interface module that can be selectively activated by the processing module based on the current use characteristics and wherein the processing module generates the power mode signal that commands the power management circuit to generate a supply voltage to power the interface module.

7. The voice data and RF IC of claim 6 wherein the interface module interfaces the voice data RF IC to a peripheral device that can be selectively activated by the processing module based on the current use characteristics and wherein the processing module generates the power mode signal that commands the power management circuit to generate a supply voltage to power the peripheral device.

8. The voice data and RF IC of claim 1 wherein the package includes the memory module.

9. The voice data and RF IC of claim 8 wherein the package includes a first die that includes the memory module and a second die that includes the processing module and wherein the first die and the second die are stacked.

10. A voice data and RF integrated circuit (IC) comprising:

a processing module, coupled to a memory module, that executes a plurality of operational instructions of at least one application and that determines a selected one of a plurality of power modes based on current use characteristics of the at least one application, and generates a power mode signal based on the selected one of the plurality of power modes; and

a power management circuit, coupled to the processing module, that receives the power mode signal and that generates a plurality of power supply signals based on the power mode signal;

wherein the voice data and RF IC is integrated in a package with a top and a bottom having a plurality of bonding pads to connect the voice data and RF IC to a circuit board, wherein the power management circuit is integrated along the bottom of the package and wherein the bonding pads are arrayed in an area of the bottom with an open center portion and wherein the power management circuit is integrated in the open center portion; and

wherein the at least one application includes at least one of: telephony application, a gaming application, a messaging application, a media playback application, and an office application.

11. A voice data and RF integrated circuit (IC) that is integrated in a package with a top and a bottom having a plurality of bonding pads to connect the voice data and RF IC to a circuit board, the voice data and RF IC comprising:

a processing module, coupled to a memory module, that executes a plurality of operational instructions of at least one application and that determines a selected one of a plurality of power modes based on current use characteristics of the at least one application, and generates a power mode signal based on the selected one of the plurality of power modes; and

a power management circuit, coupled to the processing module, that receives the power mode signal and that generates a plurality of power supply signals based on the power mode signal; and

an interface module that is selectively activated by the processing module when the current use characteristics indicate the interface module is currently in use by the at least one application and is selectively deactivated by the processing module when the current use characteristics indicate the interface module is currently not in use by the at least one application and wherein the processing module generates the power mode signal that commands the power management circuit to generate a supply voltage to power the interface module when the interface module is activated.

12. The voice data and RF IC of claim 11 further comprising:

a universal serial bus (USB) interface module that can be selectively activated by the processing module based on the current use characteristics and wherein the processing module generates the power mode signal that commands the power management circuit to generate a USB supply voltage.

13. The voice data and RF IC of claim 11 wherein the power management circuit generates an additional supply voltage in response to the power mode signal.

14. The voice data and RF IC of claim 11 wherein the power management circuit adjusts a supply voltage in response to the power mode signal.

15. The voice data and RF IC of claim 11 wherein the power management circuit adjusts a supply current limit in response to the power mode signal.

16. The voice data and RF IC of claim 11 wherein the power management unit is integrated along the bottom of the package.

17. The voice data and RF IC of claim 11 wherein the interface module interfaces the voice data RF IC to a peripheral device that can be selectively activated by the processing module based on the current use characteristics and wherein the processing module generates the power mode signal that commands the power management circuit to generate a supply voltage to power the peripheral device.

18. The voice data and RF IC of claim 11 wherein the bonding pads are arrayed in an area of the bottom with an open center portion and wherein the power management unit is integrated in the open center portion.

19. The voice data and RF IC of claim 11 wherein the package includes a first die that includes the memory module and a second die that includes the processing module and wherein the first die and the second die are stacked.

20. A method comprising:

determining a selected one of a plurality of power modes based on current use characteristics of at least one application of a voice data and RF integrated circuit (IC) wherein the voice data and RF IC includes an interface module that can be selectively activated by a processing module when the current use characteristics indicate the interface module is currently in use by the at least one application and is selectively deactivated by the processing module when the current use characteristics indicate the interface module is currently not in use by the at least one application, wherein the interface module interfaces the voice data and RF IC to a peripheral device that can be selectively activated by the processing module when the current use characteristics indicate the peripheral device is currently in use by the at least one application and is selectively deactivated by the processing module when the current use characteristics indicate the peripheral device is currently not in use by the at least one application;

generating a power mode signal based on the selected one of the plurality of power modes to command a power management circuit to generate a supply voltage to power the interface module and the peripheral device;

receiving the power mode signal at the power management circuit; and

generating a plurality of power supply signals in the power management circuit based on the power mode signal, wherein the plurality of power supply signals include the voltage to power the interface module when the interface module is activated and the peripheral device when the peripheral device is activated.

21. The method of claim 20 wherein the voice data and RF IC includes a universal serial bus (USB) interface module that can be selectively activated by the processing module based on the current use characteristics and wherein the step of generating the power mode signal generates the power mode signal that commands the power management circuit to generate a USB supply voltage.

22. The method of claim 20 wherein the step of generating a plurality of power supply signals includes generating an additional supply voltage in response to the power mode signal.

23. The method of claim 20 wherein the step of generating a plurality of power supply signals adjusts a supply voltage in response to the power mode signal.

24. The method of claim 20 wherein the step of generating a plurality of power supply signals adjusts a supply current limit in response to the power mode signal.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER IN THE INCORRECT US PATENT NO. 8,876,094 PREVIOUSLY RECORDED ON REEL 047351 FRAME 0384. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 049248/0558 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF THE MERGER PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0910. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047351/0384 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0910 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2012
From: ROFOUGARAN, AHMADREZA; ROFOUGARAN, MARYAM
To: BROADCOM CORPORATION
Reel/Frame 029206/0780 →
Continuity (2)
Continuation 11643167 · Dec 20, 2006
Related Publication 20130053112A1 · Feb 28, 2013