Apparatus for semiconductor processing

1. An apparatus for semiconductor processing, comprising:

a reaction chamber having a gate through which a substrate to be processed is transferred;

a pair of shower heads disposed at an upper side of the reaction chamber, for spraying gas so as to perform semiconductor processing;

a pair of wafer supporting units disposed at an inner lower side of the reaction chamber in correspondence to each of the shower heads, for supporting the substrate;

a pair of processing space forming units disposed in the reaction chamber, for forming and sealing a processing space for semiconductor processing surrounding the shower head and the wafer supporting unit;

a pair of exhausting systems respectively connected to the processing space forming units, wherein the exhausting system controls pressure and air exhaustion inside the reaction chamber and the processing space formed by the processing space forming unit; and

a transferring unit provided between the wafer supporting units and the gate, for transferring a substrate to be processed to the wafer supporting units, or for carrying out a substrate having been processed through the gate;

wherein the transferring unit comprises a pair of robot arms having one end connected to a rotation driving unit disposed at the reaction chamber, and another end reciprocatingly-rotating between the respective wafer supporting units and the gate, for transferring the substrate;

wherein a cassette unit for loading a plurality of substrates is further disposed between the transferring unit and the gate; and

wherein the pair of robot arms respectively transfer substrate to be processed from the cassette to the respective wafer supporting units, and the processed substrate from the respective wafer supporting units to the cassette.

2. The apparatus of claim 1 , wherein the robot arms are disposed with different heights from each other so as to prevent interference from each other when rotated.

3. The apparatus of claim 1 , wherein the cassette unit is disposed so as to be vertically movable by a driving unit.

4. The apparatus of claim 1 , wherein the cassette unit comprises a temperature controller for controlling a temperature of a substrate to be loaded.

5. The apparatus of one of claim 1 , wherein the processing space forming unit is implemented as a cylinder valve disposed in the reaction chamber so as to be vertically movable and forming a processing space when upwardly moved.

6. The apparatus of claim 5 , wherein a gas injecting unit for injecting gas to an edge portion of a substrate so as to prevent the edge portion of the substrate from being deposited is further provided at the cylinder valve.

7. The apparatus of claim 6 , wherein the gas injecting unit comprises:

a gas injecting ring having a plurality of injection holes at an inner side of the cylinder valve, the gas injecting ring being connected a gas supplying unit installed outside by a gas supplying pipe.

8. The apparatus of claim 5 , wherein a temperature controller for controlling a temperature of the cylinder valve according to a condition of semiconductor processing is further provided in the cylinder valve.

9. The apparatus of claim 5 , wherein a liner for protecting a sealing member is further provided at an inner wall of the cylinder valve.

10. The apparatus of claim 9 , wherein a lower end of the liner is extending to be lower than a bottom surface of a substrate so as to prevent a plasma from being generated.

11. The apparatus of claim 9 , wherein an end of the cylinder valve is stepped between the processing space and an outer surface of the cylinder valve so as to protect the sealing member, and a portion of the cylinder valve where the sealing member is installed has a different height from a portion contacting the processing space.