IP Library › Granted Patent US 8,742,394
Granted Patent B2
US 8,742,394 · App. 13/550,968 · Granted Jun 3, 2014

Semiconductor light-emitting element

Inventor: Takuya Kazama (Tokyo, JP)
Assignee: Stanley Electric Co., Ltd.
H01L33/38
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Quick Facts
Patent No.
US 8,742,394
App. No.
13/550,968
Granted
Jun 3, 2014
Kind
B2
Abstract

A semiconductor light-emitting element includes a support substrate, a semiconductor film including a light-emitting layer provided on the support substrate, a surface electrode provided on a light-extraction-surface-side surface of the semiconductor film, and a light-reflecting layer provided between the support substrate and the semiconductor film, forming a light-reflecting surface. The surface electrode includes a first electrode piece and a second electrode piece. The light-reflecting layer includes a reflection electrode including a third electrode piece and a fourth electrode piece. The first electrode piece and the third electrode piece are arranged so as to not overlap when projected onto a projection surface parallel to a principal surface of the semiconductor film, and the shortest distance between the first electrode piece and the fourth electrode piece, is greater than the shortest distance between the first electrode piece and the third electrode piece.

Claims (20)

1. A semiconductor light-emitting element including:

a support substrate;

a semiconductor film including a light-emitting layer provided on said support substrate;

a surface electrode provided on a light-extraction-surface-side surface of said semiconductor film; and

a light-reflecting layer provided between said support substrate and said semiconductor film, forming a light-reflecting surface on a surface bordering said semiconductor film;

wherein said surface electrode includes a first electrode piece forming an ohmic contact with said semiconductor film, and a second electrode piece electrically connected to said first electrode piece, the second electrode piece adapted for forming a Schottky contact with said semiconductor film and forming a barrier inhibiting a forward current in said semiconductor film;

wherein said light-reflecting layer includes a reflection electrode, said reflection electrode including a third electrode piece forming an ohmic contact with said semiconductor film, and a fourth electrode piece electrically connected to said third electrode piece, adapted for forming an ohmic contact with said semiconductor film, and arranged opposite said second electrode piece;

wherein said first electrode piece and said third electrode piece are arranged so as to not overlap when projected onto a projection surface parallel to a principal surface of said semiconductor film; and

wherein a shortest distance, in a direction of a principal surface of said semiconductor film, between said first electrode piece and said fourth electrode piece, is greater than a shortest distance, in the direction of the principal surface of said semiconductor film, between said first electrode piece and said third electrode piece.

2. The semiconductor light-emitting element according to claim 1 , wherein said second electrode piece is a power supply pad.

3. The semiconductor light-emitting element according to claim 1 , wherein said light-reflecting layer includes a dielectric layer provided to a surface layer thereof; and said dielectric layer is provided, on a surface at which said light-reflecting layer borders said semiconductor film, between said third electrode piece and said fourth electrode piece.

4. The semiconductor light-emitting element according to claim 3 , wherein

said first electrode piece is dispersedly arranged on said principal surface, and electrically connected to said second electrode piece via a wire electrode; and

said third electrode piece includes an electrode piece arranged directly below a region between said first electrode piece and said second electrode piece and separated from said fourth electrode piece by said dielectric layer on a surface bordering said semiconductor film.

5. The semiconductor light-emitting element according to claim 1 , wherein a distance between said second electrode piece and said fourth electrode piece is smaller than the shortest distance, in the direction of the principal surface of said semiconductor film, between said first electrode piece and said third electrode piece.

6. The semiconductor light-emitting element according to claim 3 , wherein the third electrode piece includes a linear line electrode extending on said light-reflecting surface, and a plurality of insular dot electrodes dispersedly arranged along said line electrode.

7. The semiconductor light-emitting element according to claim 3 , wherein

said first electrode piece has a linear shape extending on said light-extraction surface; and

said dielectric layer has an annular portion and a linear portion, the annular portion surrounding an outer periphery of said fourth electrode piece, and the linear portion extending along said first electrode piece and directly below said first electrode piece.

8. The semiconductor light-emitting element according to claim 1 , wherein said semiconductor film includes a layer made from AlGaInP, an n-type semiconductor layer being arranged on a light-reflecting-surface side, and a p-type semiconductor layer being arranged on said light-extraction-surface side.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 14, 2012
From: KAZAMA, TAKUYA
To: STANLEY ELECTRIC CO., LTD.
Reel/Frame 028781/0594 →
Priority Claims (1)
JP 2011-160060 · Jul 21, 2011 · national
Continuity (1)
Related Publication 20130020552A1 · Jan 24, 2013