IP Library › Granted Patent US 8,742,444
Granted Patent B2
US 8,742,444 · App. 13/572,178 · Granted Jun 3, 2014

Semiconductor light-emitting device

Inventors: Masataka Ohta (Osaka, JP); Takeshi Kamikawa (Osaka, JP)
Assignee: Sharp Kabushiki Kaisha
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Quick Facts
Patent No.
US 8,742,444
App. No.
13/572,178
Granted
Jun 3, 2014
Kind
B2
Abstract

A semiconductor light-emitting device (A) having a simple configuration whereby it is possible to easily and accurately confirm whether or not ultraviolet light is being emitted, the semiconductor light-emitting device comprising: a semiconductor light-emitting element ( 1 ) for emitting ultraviolet light in an ultraviolet or deep ultraviolet region; a cap part ( 6 ) having a through-hole ( 63 ) in the top part through which ultraviolet light passes and encircling the semiconductor light-emitting element ( 1 ); a translucent cover ( 7 ) for transmitting ultraviolet light, the translucent cover being disposed so as to hermetically close up the through-hole ( 63 ); and a UV-excited phosphor ( 8 ) which is excited by ultraviolet light and which emits visible light, the UV-excited phosphor being disposed inside the cap part ( 6 ).

Claims (17)

1. A semiconductor light-emitting device comprising:

a semiconductor light-emitting element for emitting ultraviolet light having a wavelength in an ultraviolet or deep ultraviolet region;

a cap part which shields the ultraviolet light, the cap part encircling the semiconductor light-emitting element;

a through-hole which is formed in a top part of the cap part and through which the ultraviolet light passes;

a translucent cover through which some or all of the ultraviolet light is transmitted, the translucent cover being disposed so as to hermetically close up the through-hole; and

a UV-excited phosphor excited by part of the ultraviolet light and emitting visible light, the UV-excited phosphor being disposed inside the cap part,

wherein the UV-excited phosphor is arranged such that the visible light passes mostly through a peripheral portion of the through-hole and the ultraviolet light passes mostly through an area of the through-hole surrounded by the peripheral portion.

2. The semiconductor light-emitting device of claim 1 , the UV-excited phosphor being disposed on at least part of the translucent cover.

3. The semiconductor light-emitting device of claim 1 , further comprising a reflective cup for reflecting ultraviolet light outputted by the semiconductor light-emitting element;

the UV-excited phosphor being disposed on at least part of the reflective cup.

4. The semiconductor light-emitting device of claim 3 , the reflective cup being configured from a material for reflecting ultraviolet light in the ultraviolet or deep ultraviolet region.

5. The semiconductor light-emitting device of claim 3 , the UV-excited phosphor disposed on the reflective cup being in contact with a material for reflecting ultraviolet light in the ultraviolet or deep ultraviolet region.

6. The semiconductor light-emitting device of claim 5 , aluminum being the material for reflecting ultraviolet light in the ultraviolet or deep ultraviolet region.

7. The semiconductor light-emitting device of claim 1 , configured so that the space encircled by the cap part and the translucent cover is airtight, the space interior being sealed by a dried gas.

8. The semiconductor light-emitting device of claim 7 , the dried gas sealed in the interior having a dew point of −10° C. or less.

9. The semiconductor light-emitting device of claim 7 , the dried gas being dry air.

10. The semiconductor light-emitting device of claim 7 , the dried gas being nitrogen.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 14, 2012
From: OHTA, MASATAKA; KAMIKAWA, TAKESHI
To: SHARP KABUSHIKI KAISHA
Reel/Frame 028781/0723 →
Priority Claims (1)
JP 2011-179583 · Aug 19, 2011 · national
Continuity (1)
Related Publication 20130043499A1 · Feb 21, 2013