Manufacturing method including deformation of supporting board to accommodate semiconductor device

1. A manufacturing method of a semiconductor device, comprising:

pressing an electronic component to a main surface of a supporting board via a first semiconductor element to bend the supporting board in a direction separating from the first semiconductor element and to form a first concave part at the supporting board, a part of the electronic component being located in the first concave part,

wherein the supporting board includes a back surface which is on a back side of the main surface,

the back surface includes a first part located below the electronic component and a second part which is other than the first part, and

wherein pressing the electronic component includes making the first part be positioned lower than the second part.

2. The manufacturing method of a semiconductor device as claimed in claim 1 ,

wherein the supporting board is heated when the electronic component is pressed to the supporting board.

3. The manufacturing method of a semiconductor device as claimed in claim 1 , further comprising:

mounting the first semiconductor element on the main surface of the supporting board.

4. The manufacturing method of a semiconductor device as claimed in claim 1 ,

wherein the electronic component is a second semiconductor element provided independently from the first semiconductor element.

5. The manufacturing method of a semiconductor device as claimed in claim 1 ,

wherein pressing the electronic component includes mounting the supporting board on a stage which includes a second concave part, and

heating the supporting board to bend a part of the supporting board in the second concave part.

6. The manufacturing method of a semiconductor device as claimed in claim 1 ,

wherein a cross section of an edge part defining an external circumferential part of the first concave part of the supporting board is expanding upward.

7. The manufacturing method of a semiconductor device as claimed in claim 1 ,

wherein pressing the electronic component includes

mounting the supporting board on a stage which includes a second concave part.

8. The manufacturing method of a semiconductor device as claimed in claim 1 ,

wherein the first semiconductor element is heated by a jig, the jig being configured to attract and hold the first semiconductor element; and

heat of the first semiconductor element is conducted to the supporting board via an outside connection terminal and the electronic component, the outside connection terminal being provided on the first semiconductor element and configured to couple the supporting board and the first semiconductor element to each other.

9. The manufacturing method of a semiconductor device as claimed in claim 1 ,

wherein the supporting board is locally heated at a temperature equal to or greater than a glass transition temperature of the supporting board.

10. A manufacturing method of a semiconductor device, comprising:

providing a second semiconductor element between a supporting board and a first semiconductor element, the supporting board including an upper surface and a lower surface, the lower surface including a first part and a second part which is other than the first part;

pressing the second semiconductor element to the upper surface of the supporting board via the first semiconductor element with the supporting board heated to bend the supporting board and to make the first part which is located below the second semiconductor element be positioned lower than the second part; and

fixing the first semiconductor element to the supporting board with the supporting board bent.

11. The manufacturing method of a semiconductor device as claimed in claim 10 ,

wherein pressing the second semiconductor element includes mounting the supporting board on a stage which includes a concave part.