IP Library Granted Patent US 8,749,434
Granted Patent B2
US 8,749,434 · App. 12/841,884 · Granted Jun 10, 2014

Dielectric resonant antenna using a matching substrate

Inventors: Myeong Woo Han (Gyunggi-do, KR); Jung Aun Lee (Gyunggi-do, KR); Chul Gyun Park (Gyunggi-do, KR); Seung Ho Choi (Seoul, KR); Moonil Kim (Gyunggi-do, KR); Kook Joo Lee (Seoul, KR)
Assignees: Samsung Electro-Mechanics Co., Ltd.; Korea University Research and Business Foundation
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Quick Facts
Patent No.
US 8,749,434
App. No.
12/841,884
Granted
Jun 10, 2014
Kind
B2
Abstract

A dielectric resonator antenna is disclosed that includes a multi-layer substrate on which a plurality of insulating layers and conductor layers are alternately stacked. The dielectric resonator antenna also includes a first conductor plate that has an opening part on the upper portion of the top insulating layer of the multi-layer substrate and a second conductor plate that is formed on the lower portion of the bottom insulating layer from the first conductor plate. The insulating layer is formed with at least two stacked layers and is disposed at a position corresponding to the opening part. The dielectric resonator antenna also includes a plurality of first metal via holes, a feeding part and a matching substrate that is stacked on the opening part and is stacked with at least one insulating layer.

Claims (23)

1. A dielectric resonator antenna, comprising:

a multi-layer substrate on which a plurality of insulating layers and conductor layers are alternately stacked;

a first conductor plate that has an opening part at the center of the upper portion of a top-most insulating layer of the multi-layer substrate;

a second conductor plate that is formed on the lower portion of a bottom-most insulating layer, the insulating layers being formed with at least two stacked layers and are disposed, at the center of a position corresponding to the opening part;

a first plurality of metal via holes that electrically connect each layer between the top insulating layer and the bottom insulating layer and vertically penetrate through the multi-layer substrate to form a metal interface surface in a vertical direction around the periphery of the opening part of the first conductor plate at a predetermined interval;

a feeding part including a feeding line to apply a high-frequency signal to the dielectric resonator embedded in the multi-layer substrate in a shape of a cavity by a metal interface surface formed with the first conductor plate, the second conductor plate, and the first plurality of metal via holes; and,

a matching substrate that is stacked on the first conductor plate so as to cover the opening part and is stacked with at least one insulating layer;

wherein the matching substrate includes a third plurality of via holes that vertically penetrate through the matching substrate;

wherein the dielectric resonator does not have patch antennas;

wherein the first conductor plate and the second conductor plate are electrically connected to each other through the first plurality of the metal via holes;

wherein the second conductor plate are directly contacted with the first plurality of metal via holes;

wherein the dielectric resonator body part includes a conductor pattern part inserted in the dielectric resonator to form the metal interface surface in a vertical direction intersecting with the feeding line;

wherein the dielectric constant of the matching substrate is smaller than that of the multi-layer substrate and is larger than that of air;

wherein the matching substrate removes a reflected wave occurred on the interface surface between the dielectric resonator body part embedded in the multi layer substrate having the high dielectric constant and the air having the low dielectric constant so as to increase a bandwidth; and

wherein the conductor pattern part removes a tangential field of an electric field formed on the dielectric resonator body part and keeps a normal field at the time of the double resonance.

2. The dielectric resonator antenna as set forth in claim 1 , wherein the conductor pattern part is inserted in the dielectric resonator to include:

a second plurality of metal via holes that vertically penetrate through the multi-layer substrate; and

at least a third conductor plate that is formed to be coupled with the second plurality of metal via holes between the insulating layers through which the second plurality of metal via holes penetrate.

3. The dielectric resonator antenna as set forth in claim 1 , wherein the feeding part is any one of a strip line structure, a micro strip line structure, or a CPW line structure.

4. The dielectric resonator antenna as set forth in claim 1 , wherein the third plurality of via holes further form the metal interface surface in a vertical direction around the periphery of the opening part.

5. The dielectric resonator antenna as set forth in claim 1 , wherein the third plurality of via holes are metal via holes.

6. The dielectric resonator antenna as set forth in claim 1 , wherein the third plurality of via holes are air via holes.

7. The dielectric resonator antenna as set forth in claim 1 , wherein when at least two matching substrates are stacked, the matching substrates are stacked to gradually reduce the dielectric constant of the stacked matching substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2010
From: HAN, MYEONG WOO; LEE, JUNG AUN; PARK, CHUL GYUN; CHOI, SEUNG HO; KIM, MOONIL; LEE, KOOK JOO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.; KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
Reel/Frame 024742/0116 →
Priority Claims (1)
KR 10-2010-0033999 · Apr 13, 2010 · national
Continuity (1)
Related Publication 20110248891A1 · Oct 13, 2011