IP Library Granted Patent US 8,754,396
Granted Patent B2
US 8,754,396 · App. 13/441,618 · Granted Jun 17, 2014

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Inventors: John A. Rogers (Champaign, IL); Dahl-Young Khang (Seoul, KR); Yugang Sun (Naperville, IL); Etienne Menard (Durham, NC)
Assignee: The Board of Trustees of the University of Illinois
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Quick Facts
Patent No.
US 8,754,396
App. No.
13/441,618
Granted
Jun 17, 2014
Kind
B2
Abstract

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Claims (43)

1. A stretchable electronic circuit comprising:

a flexible substrate;

an intermediate layer that is at least partially supported on a surface of the flexible substrate; and

an electronic circuit that is supported by the surface of the flexible substrate and at least partially embedded in the intermediate layer; wherein the at least partially embedded portion of the electronic circuit comprises at least one semiconductor structure having a curved internal surface that provides stretchability to isolate the electronic circuit from an applied strain.

2. The stretchable electronic circuit of claim 1 , wherein the curved internal surface has at least one convex region, at least one concave region, or a combination of at least one convex region and at least one concave region.

3. The stretchable electronic circuit of claim 2 , wherein the curved internal surface has a combination of convex and concave regions.

4. The stretchable electronic circuit of claim 1 , wherein the curved internal surface has a contour profile comprising a periodic wave or an aperidioc wave.

5. The stretchable electronic circuit of claim 1 , wherein the curved internal surface has a contour profile that varies spatially in one-dimension.

6. The stretchable electronic circuit of claim 1 , wherein the electronic circuit comprises an array or pattern of stretchable semiconductor structures having curved internal surfaces.

7. The stretchable electronic circuit of claim 1 , wherein the electronic circuit comprises metal interconnects having a wave-shaped or wrinkled conformation, wherein the metal interconnects electrically connect device components of the electronic circuit.

8. The stretchable electronic circuit of claim 1 , further comprising an encapsulating layer or a coating, wherein the encapsulating layer or the coating at least partially encapsulates the electronic circuit.

9. The stretchable electronic circuit of claim 8 , wherein the encapsulating layer or the coating comprises a polymer.

10. The stretchable electronic circuit of claim 1 , wherein the intermediate layer is an adhesive layer, a laminating layer, a coating or a thin film.

11. The stretchable electronic circuit of claim 1 , wherein the intermediate layer comprises a polyimide.

12. The stretchable electronic circuit of claim 1 , wherein the flexible substrate comprises a polymer or paper.

13. The stretchable electronic circuit of claim 1 , wherein discrete points of the semiconductor structure curved internal surface are bonded to the surface of the flexible substrate, wherein the discrete points of bonding are separated from each other by a buckled region of the semiconductor structure that is not directly bound to the flexible substrate, and wherein the buckled region of the semiconductor structure is not in physical contact with the surface of the flexible substrate.

14. The stretchable electronic circuit of claim 1 , wherein the electronic circuit comprises a material selected from the group consisting of: Si, Ge, SiC, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InP, InAs, InSb, ZnO, ZnSe, ZnTe, CdS, CdSe, CdTe, HgS, PbS, PbSe, PbTe, AlGaAs, AlInAs, AlInP, GaAsP, GaInAs, GaInP, AlGaAsSb, AlGaInP, GaInAsP and carbon nanotubes.

15. The stretchable electronic circuit of claim 1 , wherein the electronic circuit comprises a printable electronic circuit.

16. The stretchable electronic circuit of claim 1 , wherein the flexible substrate has a first Young's modulus, and wherein the intermediate layer has a second Young's modulus that is less than the first Young's modulus of the flexible substrate.

17. The stretchable electronic circuit of claim 16 , further comprising an encapsulating layer or a coating, wherein the encapsulating layer or coating at least partially encapsulates the electronic circuit, and wherein the encapsulating layer or coating has a third Young's modulus that is less than the first Young's modulus of the flexible substrate.

18. A stretchable electronic circuit comprising:

a flexible substrate;

an intermediate layer that is at least partially supported on a surface of the flexible substrate;

an electronic circuit that is supported on the surface of the flexible substrate and at least partially embedded in the intermediate layer, the at least partially embedded portion of the electronic circuit comprising at least one semiconductor structure having a curved internal surface to provide stretchability; and

an encapsulating layer or coating that at least partially encapsulates the electronic circuit;

wherein the encapsulating layer or coating enhances a mechanical stability of the stretchable electronic circuit.

19. The stretchable electronic circuit of claim 18 , wherein the curved internal surface has a contour profile with a combination of at least one convex region and at least one concave region.

20. The stretchable electronic circuit of claim 18 , wherein the intermediate layer is an adhesive layer, a laminating layer, a coating or a thin film.

21. The stretchable electronic circuit of claim 18 , wherein the intermediate layer comprises a polyimide.

22. The stretchable electronic circuit of claim 18 , wherein the encapsulating layer or coating comprises a polymer.

23. The stretchable electronic circuit of claim 18 , wherein the flexible substrate comprises a polymer or paper.

24. The stretchable electronic circuit of claim 18 , the curved internal surface of the semiconductor structure having discrete points bonded to the flexible substrate, wherein the discrete points of bonding are separated from each other by a buckled region of the semiconductor structure that is not directly bound to the flexible substrate intermediate layer, and wherein the buckled region of the semiconductor structure is not in physical contact with the surface of the flexible substrate.

25. The stretchable electronic circuit of claim 18 , wherein the electronic circuit comprises a material selected from the group consisting of: Si, Ge, SiC, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InP, InAs, InSb, ZnO, ZnSe, ZnTe, CdS, CdSe, CdTe, HgS, PbS, PbSe, PbTe, AlGaAs, AlInAs, AlInP, GaAsP, GaInAs, GaInP, AlGaAsSb, AlGaInP, GaInAsP and carbon nanotubes.

26. The stretchable electronic circuit of claim 18 , wherein the electronic circuit comprises a printable electronic circuit.

27. The stretchable electronic circuit of claim 18 , wherein the flexible substrate has a first Young's modulus, and wherein the encapsulating layer or coating has a second Young's modulus that is less than the first Young's modulus of the flexible substrate.

28. The stretchable electronic circuit of claim 27 , further comprising an intermediate layer that is at least partially supported on a surface of the flexible substrate, wherein the electronic circuit is at least partially supported on a surface of the intermediate layer, wherein the intermediate has a third Young's modulus that is less than the first Young's modulus of the flexible substrate.

29. The stretchable electronic circuit of claim 18 , wherein the electronic circuit comprises metal interconnects having a wave-shaped or wrinkled conformation, wherein the metal interconnects electrically connect device components of the electronic circuit.

30. A stretchable electronic circuit comprising:

a flexible substrate having a first Young's modulus;

an intermediate layer that is at least partially supported on a surface of the flexible substrate, the intermediate having a second Young's modulus that is less than the first Young's modulus of the flexible substrate;

an electronic circuit that is supported on the surface of the flexible substrate and at least partially embedded in the intermediate layer; and

an encapsulating layer or coating that at least partially encapsulates the electronic circuit, the encapsulating layer or coating having a third Young's modulus that is less than the first Young's modulus of the flexible substrate.

31. The stretchable electronic circuit of claim 1 , wherein the electronic circuit is fully embedded in the intermediate layer.

Assignments (2)
CONFIRMATORY LICENSE Recorded Sep 16, 2024
From: BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
To: U.S. DEPARTMENT OF ENERGY
Reel/Frame 068959/0705 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2013
From: ROGERS, JOHN A; KHANG, DAHL-YOUNG; SUN, YUGANG; MENARD, ETIENNE
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 031386/0663 →
Continuity (11)
Continuation 12405475 · Mar 17, 2009
Division 11423287 · Jun 9, 2006
Continuation In Part 11145542 · Jun 2, 2005
Continuation In Part 11145574 · Jun 2, 2005
Provisional Application 60577077 · Jun 4, 2004
Provisional Application 60601061 · Aug 11, 2004
Provisional Application 60650305 · Feb 4, 2005
Provisional Application 60663391 · Mar 18, 2005
Provisional Application 60677617 · May 4, 2005
Provisional Application 60790104 · Apr 7, 2006
Related Publication 20130100618A1 · Apr 25, 2013