Package carrier
A package carrier includes a metal substrate, a pad, a dielectric layer, and a circuit layer. The metal substrate has a first surface and a second surface opposite to the first surface. The pad is disposed on the first surface. The dielectric layer is disposed on the first surface and covers the pad. A thickness of the dielectric layer is less than 150 μm. The circuit layer is embedded in the dielectric layer and connected to the pads.
1. A package carrier comprising:
a metal substrate having a first surface and a second surface opposite to the first surface;
a pad disposed on the first surface;
a first dielectric layer disposed on the first surface and covering the pad, a thickness of the first dielectric layer being less than 150 μm, wherein the pad is embedded in the first dielectric layer; and
a first circuit layer embedded in the first dielectric layer and connected to the pad.
2. The package carrier as recited in claim 1 , wherein a line width of the first circuit layer is less than 15 μm.
3. The package carrier as recited in claim 1 , further comprising a passivation layer disposed on the first dielectric layer, the passivation layer exposing the first circuit layer.
4. The package carrier as recited in claim 1 , further comprising a surface treatment layer disposed on the first circuit layer.
5. The package carrier as recited in claim 1 , further comprising a conductive layer encapsulating the metal substrate.
6. The package carrier as recited in claim 1 , further comprising:
a second dielectric layer disposed on the first dielectric layer and covering the first circuit layer;
a second circuit layer embedded in the second dielectric layer; and
a conductive via disposed in the second dielectric layer and connected to the first circuit layer and the second circuit layer.
7. The package carrier as recited in claim 6 , wherein a line width of the second circuit layer is less than 15 μm.
8. The package carrier as recited in claim 6 , further comprising a passivation layer disposed on the second dielectric layer, the passivation layer exposing the second circuit layer.
9. The package carrier as recited in claim 6 , further comprising a surface treatment layer disposed on the second circuit layer.
10. A package carrier comprising:
a metal substrate having a first surface and a second surface opposite to the first surface;
a pad disposed on the first surface;
a first dielectric layer disposed on the first surface and covering the pad, a thickness of the first dielectric layer being less than 150 μm, wherein the pad is embedded in the first dielectric layer;
a first circuit layer disposed on the first dielectric layer; and
a first conductive via disposed in the first dielectric layer and connected to the first circuit layer and the pad.
11. The package carrier as recited in claim 10 , wherein a line width of the first circuit layer is greater than or substantially equal to 15 μm.
12. The package carrier as recited in claim 10 , further comprising a passivation layer disposed on the first dielectric layer, the passivation layer exposing the first circuit layer.
13. The package carrier as recited in claim 10 , further comprising a surface treatment layer disposed on the first circuit layer.
14. The package carrier as recited in claim 10 , further comprising a conductive layer encapsulating the metal substrate.
15. The package carrier as recited in claim 10 , further comprising:
a second dielectric layer disposed on the first dielectric layer and covering the first circuit layer;
a second circuit layer disposed on the second dielectric layer; and
a second conductive via disposed in the second dielectric layer and connected to the first circuit layer and the second circuit layer.
16. The package carrier as recited in claim 15 , wherein a line width of the second circuit layer is greater than or substantially equal to 15 μm.
17. The package carrier as recited in claim 15 , further comprising a passivation layer disposed on the second dielectric layer, the passivation layer exposing the second circuit layer.
18. The package carrier as recited in claim 15 , further comprising a surface treatment layer disposed on the second circuit layer.