Solid-state imaging element, manufacturing method, and electronic device

1. A solid-state imaging element comprising:

a pixel including a photoelectric conversion section formed in a semiconductor substrate of a first conductivity type having a first impurity concentration;

a side pinning layer formed on a side of the photoelectric conversion section, wherein the side pinning layer is formed of the first conductivity type having a higher impurity concentration than the first impurity concentration; and

an anode of the photoelectric conversion section comprising a pixel separating section surrounding sides of the photoelectric conversion section, wherein the pixel separating section comprises at least two sides in contact with the semiconductor substrate of the first conductivity type having the first impurity concentration, and wherein a negative potential is supplied to the anode of the photoelectric conversion section.

2. The solid-state imaging element according to claim 1 ,

wherein the side pinning layer is formed in a region surrounding the side of the photoelectric conversion section.

3. The solid-state imaging element according to claim 1 ,

wherein the side pinning layer is formed by performing ion implantation from an inclined direction with respect to a surface of the semiconductor substrate.

4. The solid-state imaging element according to claim 1 , further comprising a surface pinning layer formed on a surface side of the photoelectric conversion section,

wherein the side pinning layer and the surface pinning layer are formed simultaneously by performing ion implantation from an inclined direction with respect to the surface of the semiconductor substrate.

5. The solid-state imaging element according to claim 1 , wherein a pixel separating section separating from an adjacent pixel is buried in a trench after the side pinning layer is formed.

6. The solid-state imaging element according to claim 1 , wherein the side pinning layer is formed by performing ion implantation in a state of a trench being open, the trench being formed in a part on a side of a region in which the photoelectric conversion section is formed.

7. A method for manufacturing a solid-state imaging element including a pixel comprising:

forming a trench in a semiconductor substrate of a first conductivity type having a first impurity concentration;

forming a photoelectric conversion section in the semiconductor substrate;

forming a side pinning layer on a side of the photoelectric conversion section, wherein the side pinning layer is formed of the first conductivity type having a higher impurity concentration than the first impurity concentration;

forming a surface pinning layer on a surface side of the photoelectric conversion section;

forming an anode of the photoelectric conversion section, wherein the anode comprises a pixel separating section formed in the trench and surrounding sides of the photoelectric conversion section the pixel separating section comprising at least two sides in contact with the semiconductor substrate of the first conductivity type having the first impurity concentration; and

connecting an anode of the photoelectric conversion section to a signal wiring such that a negative potential is supplied to the photoelectric conversion section.

8. The method for manufacturing a solid-state imaging element according to claim 7 , further comprising forming the side pinning layer in a region surrounding the side of the photoelectric conversion section.

9. The method for manufacturing a solid-state imaging element according to claim 7 , further comprising forming the side pinning layer by performing ion implantation from an inclined direction with respect to a surface of the semiconductor substrate.

10. The method for manufacturing a solid-state imaging element according to claim 7 , wherein the side pinning layer and the surface pinning layer are formed simultaneously by performing ion implantation from an inclined direction with respect to the surface of the semiconductor substrate.

11. The method for manufacturing a solid-state imaging element according to claim 7 , further comprising burying the pixel separating section in the trench after forming the side pinning layer.

12. The method for manufacturing a solid-state imaging element according to claim 7 , further comprising forming the side pinning layer by performing ion implantation when a trench is open, the trench being formed in a part on a side of a region in which the photoelectric conversion section is formed and including the pixel separating section.

13. An electronic device comprising:

a solid-state imaging element including a pixel having a photoelectric conversion section formed in a semiconductor substrate of a first conductivity type having a first impurity concentration;

a side pinning layer formed on a side of the photoelectric conversion section, wherein the side pinning layer is formed of the first conductivity type having a higher impurity concentration than the first impurity concentration; and

an anode of the photoelectric conversion section comprising a pixel separating section surrounding sides of the photoelectric conversion section, wherein the pixel separating section comprises at least two sides in contact with the semiconductor substrate of the first conductivity type having the first impurity concentration, and wherein a negative potential is supplied to the anode of the photoelectric conversion section.

14. The electronic device according to claim 13 ,

wherein the side pinning layer is formed in a region surrounding the side of the photoelectric conversion section.

15. The electronic device according to claim 13 ,

wherein the side pinning layer is formed by performing ion implantation from an inclined direction with respect to a surface of the semiconductor substrate.

16. The electronic device according to claim 13 , further comprising a surface pinning layer formed on a surface side of the photoelectric conversion section,

wherein the side pinning layer and the surface pinning layer are formed simultaneously by performing ion implantation from an inclined direction with respect to the surface of the semiconductor substrate.

17. The electronic device according to claim 13 , wherein the side pinning layer is formed by performing ion implantation when the trench is open, the trench being formed in a part on a side of a region in which the photoelectric conversion section is formed.

18. The electronic device according to claim 13 ,

wherein the pixel separating section separating the pixel from an adjacent pixel is buried in a trench after the side pinning layer is formed.

19. The electronic device according to claim 18 ,

wherein a negative potential is supplied to the pixel separating section in timing of transfer of a charge accumulated in the photoelectric conversion section.