Light emitting systems and methods

1. A light-emitting system comprising:

at least one light-emitting device, said at least one light-emitting device comprising a p-doped region, an n-doped region, an active region disposed between said p-doped region and n-doped region, an n-contact layer disposed on the n-doped layer and a p-contact layer disposed on the p-doped layer;

a carrier with conductive patterns disposed thereon forming a circuit for connecting to a power source for operating said at least one light-emitting device, said formed circuit being in electrical communication with the n-contact layer and p-contact layer of the light-emitting device;

said at least one light-emitting device is mounted on said carrier with a non-conductive adhesive disposed on said carrier such that at least one of the p-contact layer and n-contact layer of the light-emitting device is in direct contact with said conductive patterns formed on said carrier; wherein said non-conductive adhesive is disposed on the carrier in the form of at least two discrete patches on the perimeter of the light-emitting device; wherein each of said discrete patches is at least one of a substantially spherical shape and a cuboid shape; and

wherein said at least one light-emitting device is selected from the group consisting of light-emitting diode, surface mount device (SMD) package incorporating at least one light-emitting diode, integrated circuit incorporating at least one light-emitting diode, or a combination thereof.

2. The light-emitting system of claim 1 wherein said p-contact layer and said n-contact layer of said light-emitting device are disposed on the same side of the light-emitting device, on the side that is opposite the light emission surface of the light-emitting device.

3. The light-emitting system of claim 1 wherein said p-contact layer and said n-contact layer of said light-emitting device are disposed on the opposite sides of the light-emitting device.

4. The light-emitting system of claim 1 further comprising a transparent encapsulation layer.

5. The light-emitting system of claim 1 further comprising a light converting phosphor layer.

6. The light-emitting system of claim 1 wherein said non-conductive adhesive is disposed on the carrier in one patch on the perimeter of the light-emitting device.

7. The light-emitting system of claim 6 wherein said non-conductive adhesive is further disposed to fill in gaps between said at least one light-emitting device and said carrier.

8. A method of making a light-emitting system in accordance with claim 1 , said method comprising:

providing at least one light-emitting device comprising a p-doped region, an n-doped region, an active region disposed between said p-doped region and n doped region, an n-contact layer disposed on the n-doped layer and a p-contact layer disposed on the p-doped layer;

providing a carrier with conductive patterns disposed thereon forming a circuit for connecting to a power source for operating said at least one light-emitting device;

placing said at least one light-emitting device on the carrier in such a way as to make at least one of said p-contact layer and said n-contact layer in direct contact with the conductive patterns on the carrier;

applying a non-conductive adhesive material on the carrier, in the form of at least two discrete patches on the perimeter of the light-emitting device, to attach the light-emitting device to the carrier; wherein each of said discrete patches is at least one of a substantially spherical shape and a cuboid shape; and

curing said non-conductive adhesive material; wherein the at least one light-emitting device is selected from the group consisting of light-emitting diode, surface mount device (SMD) package incorporating at least one light-emitting diode, integrated circuit incorporating at least one light-emitting diode, or a combination thereof.

9. The method of claim 8 wherein said p-contact layer and said n-contact layer are disposed on the same side of the light-emitting device, on the side that is opposite the light emission surface of the light-emitting device.

10. The method of claim 8 wherein said p-contact layer and said n-contact layer are disposed on the opposite sides of the light-emitting device.

11. The method of claim 10 further comprising electrically connecting one of the p-contact and n-contact layer of the light emitting device to the conductive circuit on the carrier.

12. The method of claim 8 wherein applying said non-conductive adhesive material is in one patch on the perimeter of the light-emitting device.

13. The method of claim 8 further comprising disposing a transparent encapsulation layer.

14. The method of claim 8 further comprising disposing a light converting phosphor layer.

15. The method of claim 8 further comprising applying said non-conductive adhesive to fill in gaps between said at least one light-emitting device and said carrier.

16. The method of claim 8 further comprising applying a downward force to the light-emitting device prior to dispensing the non-conductive adhesive.

17. The method of claim 8 further comprising lighting up the light-emitting device by applying voltage to said device prior to curing the non-conductive adhesive to test if the device is functional.

18. A method of making a light-emitting system in accordance with claim 1 , said method comprising:

providing at least one light-emitting device comprising a p-doped region, an n-doped region, an active region disposed between said p-doped region and n-doped region, an n-contact layer disposed on the n-doped layer and a p-contact layer disposed on the p-doped layer;

providing a carrier with conductive patterns disposed thereon forming a circuit for connecting to a power source for operating said at least one light-emitting device;

applying a non-conductive adhesive material in the form of at least two discrete patches on the perimeter of the light-emitting device, wherein each of said discrete patches is at least one of a substantially spherical shape and a cuboid shape;

placing said at least one light-emitting device on the carrier in such a way as to make at least one of said p-contact layer and said n-contact layer in direct contact with the conductive patterns on the carrier;

and curing said non-conductive adhesive material; wherein the at least one light-emitting device is selected from the group consisting of light-emitting diode, surface mount device (SMD) package incorporating at least one light-emitting diode, integrated circuit incorporating at least one light-emitting diode, or a combination thereof.

19. The method of claim 18 further comprising applying a downward force to the light-emitting device after placing the light-emitting device on the carrier.

20. The method of claim 19 wherein applying the downward force to the light-emitting device is further conducted while the adhesive is being cured.

21. The method of claim 18 wherein said non-conductive adhesive material is applied to cover some portions of said conductive patterns.

22. The method of claim 18 wherein said non-conductive adhesive material is applied to cover some portions of said carrier without covering said conductive patterns.