Panelized process for SMT sensor devices
View Patent ↗A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate including window elements is mapped to a similar grid. The cover plate is bonded to the base plate, such that the window elements are positioned to allow incident electromagnetic radiation upon corresponding sensors mounted on the printed circuit board. Each sensor footprint is sealed within a recess or cell beneath the cover. The sensor circuits may be tested before and/or after being separated into individual SMT sensor packages.
1. A process for manufacturing a surface mount technology (SMT) sensor device, comprising the steps of:
forming a support substrate;
mapping a grid comprising a plurality of sensor footprints on said substrate;
affixing a sensor within each said plurality of sensor footprints;
forming a lid comprising a plurality of sensor encapsulating covers having transparent members, wherein said plurality of encapsulating covers are configured to correspond to said plurality of sensor footprints in a one-to-one fashion;
aligning said lid to said support substrate;
bonding said lid to said support substrate to form a panel, wherein a cavity is formed above each sensor and below each transparent member; and
cutting said panel according to said grid to form an SMT sensor device.
2. The process of claim 1 , wherein said sensor is an optical sensor configured to detect wavelengths in the visible spectrum.
3. The process of claim 1 , wherein said sensor is an infrared sensor.
4. The process of claim 1 , wherein said bonding occurs in a gas controlled environment.
5. The process of claim 1 , wherein each of said transparent members comprises a lens.
6. The process of claim 1 , wherein each of said transparent members comprises a filter.
7. The process of claim 6 , further comprising the step of:
if said sensor fails said test, marking said sensor as defective.
8. The process of claim 7 , further comprising the step of:
after said cutting, discarding said SMT sensor if said SMT sensor was marked as defective.
9. The process of claim 1 , further comprising the step of testing said sensor.
10. The process of claim 9 , wherein said testing occurs prior to said bonding and cutting steps.
11. The process of claim 9 , wherein said testing occurs prior to said cutting step.
12. The process of claim 1 , further comprising the step of:
introducing a gas into said gas controlled environment, wherein said gas is retained within said cavity after said bonding.