Method for manufacturing conductive adhesive containing one-dimensional conductive nanomaterial
A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.
1. A method for manufacturing a conductive adhesive containing at least one one-dimensional (1D) conductive nanomaterial comprising the steps of:
adding and dispersing at least one conductive nanomaterial into ethanol to form a nanoscale dispersing solution; the conductive nanomaterial is in the form of nanowires, nanotubes, nanorods, or conductive material with 1D nanostructure;
adding a modification solution to the nanoscale dispersing solution to form a mixed solution;
then stirring and heating the mixed solution;
adding a resin solution to the mixed solution and mixing the mixed solution with the resin solution evenly to get a conductive adhesive; and
modifying rheological properties of the conductive adhesive;
Wherein the modification solution is used to change the surface properties of the nanomaterial for dispersing the nanomateiral in the resin solution with no aggregation and adjusting surface electrical resistivity of the conductive adhesive, the modification solution including a surface modifying agent mixed with acetone.
2. The method as claimed in claim 1 , wherein the conductive nanomaterial is selected from silver, gold, copper, iron, nickel, tin, electrically conductive metal or electrically conductive metal oxide.
3. The method as claimed in claim 1 , wherein the surface modifying agent that is a silane surface modifying agent or a borane surface modifying agent and the silane surface modifying agent comprises silane groups and hydrophilic groups while the borane surface modifying agent contains borane groups and hydrophilic groups.
4. The method as claimed in claim 1 , wherein solid content of the conductive nanomaterial ranges from 1 phr to 400 phr.
5. The method as claimed in claim 1 , wherein the resin solution includes a solvent-based resin and a curing agent.
6. The method as claimed in claim 1 , wherein in the step of modifying rheological properties of the conductive adhesive, a thixotropic agent or a thickening agent is added for modifying the rheological properties of the conductive adhesive.