Integrated flex tail circuit packaging
An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board.
1. An integrated structure, comprising:
a logic board;
a plurality of integrated circuits mounted on or in the logic board;
a through mold via (TMV) module mounted on or in the logic board, the TMV module comprising:
a substrate;
at least one component coupled to the substrate;
a body encapsulating the at least one component; and
one or more vias that extend all of the way through the substrate and the body; and
a flexible printed circuit board (flex-PCB) directly coupled to the substrate of the TMV module, wherein the one or more vias provide an interconnection between the at least one component, the flexible printed circuit board, and at least some of the integrated circuits in the plurality of integrated circuits.
2. The integrated structure of claim 1 further comprising at least one component on each side of the flex-PCB.
3. The integrated structure of claim 1 further comprising a second flex-PCB coupled to the flex-PCB to form a flex-on-flex structure.
4. The integrated structure of claim 1 further comprising:
a second TMV module coupled to the TMV module and comprising a second substrate; and
a second flex-PCB directly coupled to the second substrate of the second TMV module, wherein a TMV is provided to communicatively couple second substrate with the TMV module.
5. The integrated structure of claim 1 , wherein the substrate comprises one of a rigid-flex or an embedded-flex (e-flex) printed circuit board and the flex-PCB is soldered thereto.
6. The integrated structure of claim 1 , wherein the body comprises a resin material potted about the substrate.
7. The integrated structure of claim 6 , wherein only a portion of the substrate is potted in the resin.
8. The integrated structure of claim 1 , wherein the substrate comprises an inverted PCB.
9. The integrated structure of claim 1 , wherein the one or more vias are filled with solder, silver paste, or plated with a conductive material or comprise metal structures that extend from the substrate and are exposed externally from the module.
10. The integrated structure of claim 1 , wherein the flex-PCB is soldered to the substrate.
11. The integrated structure of claim 1 wherein the at least one component comprises a capacitor.
12. The integrated structure of claim 1 wherein the at least one component comprises an inductor.
13. The integrated structure of claim 1 wherein the at least one component comprises an integrated circuit.
14. The integrated structure of claim 1 wherein the at least one component comprises a resistor.