Non-contact test system for determining whether electronic device structures contain manufacturing faults

1. A method for testing electronic device housing structures under test using a tester that has a test unit and an associated antenna probe, comprising:

generating radio-frequency test signals with the test unit;

wirelessly transmitting the radio-frequency test signals to the device housing structures under test using the antenna probe;

receiving corresponding radio-frequency test signals from the device housing structures under test using the antenna probe;

providing the received radio-frequency test signals to the test unit from the antenna probe;

determining from at least the received radio-frequency test signals whether the device housing structures under test contain a fault; and

performing calibration operations to obtain calibration data, wherein determining from at least the received radio-frequency test signals whether the device housing structures under test contain a fault comprises comparing the received radio-frequency test signals to the calibration data.

2. The method defined in claim 1 , wherein the received radio-frequency test signals comprises reflected radio-frequency test signals, and wherein determining from at least the received radio-frequency test signals whether the device housing structures under test contain a fault comprises using the reflected radio-frequency test signals to determine whether the device housing structures under test contain a fault.

3. The method defined in claim 2 further comprising issuing an alert with the tester when comparing the reflected radio-frequency test signals to the calibration data reveals that the reflected radio-frequency test signals and the calibration data differ by more than a predetermined amount.

4. The method defined in claim 1 , wherein performing the calibration operations comprises gathering the calibration data by using the test unit and antenna probe to perform measurements on a properly assembled version of the device housing structures under test.

5. The method defined in claim 4 wherein the antenna probe contains first and second test antennas and wherein wirelessly transmitting the radio-frequency test signals comprises wirelessly transmitting the radio-frequency test signals using the first and second test antennas.

6. The method defined in claim 5 wherein the device housing structures under test include first and second device antennas, the method further comprising placing the first and second test antennas respectively in the vicinity of the first and second device antennas while transmitting the radio-frequency test signals.

7. The method defined in claim 4 wherein the antenna probe contains at least one probe antenna and wherein the device housing structures under test include at least one device antenna, the method further comprising placing the antenna probe in the vicinity of the device antenna while transmitting the radio-frequency test signals.

8. The method defined in claim 1 wherein the device housing structures under test include a first connector and include a second connector coupled to an antenna resonating element and wherein determining from at least the received radio-frequency test signals whether the device housing structures under test contain a fault comprises determining whether the first and second connectors are properly connected to each other.

9. The method defined in claim 1 further comprising:

placing the device housing structures under test in a test fixture before wirelessly transmitting the radio-frequency test signals to the device structures under test using the antenna probe.

10. A method for testing electronic device housing structures under test using a tester that has at least one test antenna, comprising:

with the tester, transmitting radio-frequency test signals to the device housing structures under test using the test antenna;

receiving corresponding radio-frequency test signals from the device housing structures under test using the test antenna;

determining from at least the received radio-frequency signals whether the device housing structures under test contain a fault; and

performing calibration operations to obtain calibration data, wherein determining from at least the received radio-frequency test signals whether the device housing structures under test contain a fault comprises comparing the received radio-frequency test signals to the calibration data.

11. The method defined in claim 10 further comprising:

in response to determining that the device housing structures under test contain a fault, displaying an alert on a display.

12. The method defined in claim 10 wherein receiving the corresponding radio-frequency test signals from the device housing structures under test using the test antenna comprises receiving near-field radio-frequency test signals.

13. A test system for performing non-contact testing on electronic device structures under test, comprising:

a test unit that generates radio-frequency test signals; and

an antenna with which the radio-frequency test signals are transmitted to the electronic device structures under test and with which corresponding radio-frequency test signals are received, wherein the test unit is configured to determine whether the electronic device structures under test include a fault based on the transmitted and received radio-frequency test signals, wherein the radio-frequency test signals that are received includes reflected versions of the transmitted radio-frequency test signals, wherein the test unit comprises a network analyzer, wherein the radio-frequency test signals include signals that range from a first frequency to a second frequency, and wherein the test unit computes complex impedance data from the transmitted and reflected versions of the radio-frequency test signals.

14. The test system defined in claim 13 , further comprising:

performing calibration operations to obtain baseline data from a known fault-free version of the electronic device structures under test, wherein the test unit is configured to compare the computed complex impedance data to the baseline data to determine whether the electronic device structures under test include a fault.