Light-emitting device and manufacturing method thereof
View Patent ↗A light-emitting device having a curved light-emitting surface is provided. Further, a highly-reliable light-emitting device is provided. A substrate with plasticity is used. A light-emitting element is formed over the substrate in a flat state. The substrate provided with the light-emitting element is curved and put on a surface of a support having a curved surface. Then, a protective layer for protecting the light-emitting element is formed in the same state. Thus, a light-emitting device having a curved light-emitting surface, such as a lighting device or a display device can be manufactured.
1. A manufacturing method of a light-emitting device comprising the steps of:
forming a layer to be separated over a support substrate;
forming a plurality of pixels including a light-emitting element over the layer;
separating the layer from the support substrate;
transferring the layer to one surface of a substrate with plasticity;
putting the substrate over which the plurality of pixels is formed over a support having a curved surface along the curved surface of the support so that the other surface opposite to the one surface of the substrate faces the support;
dropping a curable material over the one surface of the substrate;
putting a protective layer over the substrate so that the curable material is in contact with part of the protective layer;
fixing the protective layer in a region where the protective layer is in contact with the curable material;
curving the protective layer along the one surface of the substrate so that a surface of the protective layer facing the substrate is in contact with the curable material in a region overlapping with the light-emitting element; and
curing the curable material.
2. The manufacturing method of a light-emitting device according to claim 1 , wherein the curable material is a photocurable material.
3. The manufacturing method of a light-emitting device according to claim 1 , wherein the substrate comprises at least one of a metal material and an alloy material.
4. The manufacturing method of a light-emitting device according to claim 1 , wherein the substrate comprises at least one of aluminum, copper, iron, nickel, titanium, and magnesium.
5. The manufacturing method of a light-emitting device according to claim 1 , wherein the protective layer comprises a glass layer.
6. The manufacturing method of a light-emitting device according to claim 1 , wherein the protective layer is a stack in which a glass layer, a bonding layer, and a resin layer are stacked.
7. A manufacturing method of a light-emitting device comprising the steps of:
forming a layer to be separated over a support substrate;
forming a plurality of pixels including a light-emitting element over the layer;
separating the layer from the support substrate;
transferring the layer to one surface of a substrate with plasticity;
putting the substrate over which the plurality of pixels is formed over a support having a curved surface along the curved surface of the support so that the other surface opposite to the one surface of the substrate faces the support;
dropping a curable material over the one surface of the substrate;
putting a protective layer over the substrate so that the curable material is in contact with part of the protective layer;
fixing the protective layer in a region where the protective layer is in contact with the curable material by curing one part of the curable material;
curving the protective layer along the one surface of the substrate so that a surface of the protective layer facing the substrate is in contact with the curable material in a region overlapping with the light-emitting element; and
curing the other part of the curable material.
8. The manufacturing method of a light-emitting device according to claim 7 , wherein the curable material is a photocurable material.
9. The manufacturing method of a light-emitting device according to claim 7 , wherein the substrate comprises at least one of a metal material and an alloy material.
10. The manufacturing method of a light-emitting device according to claim 7 , wherein the substrate comprises at least one of aluminum, copper, iron, nickel, titanium, and magnesium.
11. The manufacturing method of a light-emitting device according to claim 7 , wherein the protective layer comprises a glass layer.
12. The manufacturing method of a light-emitting device according to claim 7 , wherein the protective layer is a stack in which a glass layer, a bonding layer, and a resin layer are stacked.