Multilayer ceramic electronic component
A multilayer ceramic electronic component includes a ceramic main body having internal electrodes laminated therein; and external electrodes formed on ends of the ceramic main body in a length direction, wherein each external electrode includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is thickness of a cover layer, Te is thickness of the internal electrode, Td is distance between neighboring internal electrodes, L 1 is length from either end of the ceramic main body in the length direction in a region in which the cover layer adjoins a margin part of the ceramic main body to an end of the first layer formed on an upper or lower surface of the ceramic main body, and Lm is length of the margin part, Tc≦70 μm and L 1 <Lm+Tc×cot 50° are satisfied.
1. A multilayer ceramic electronic component, comprising:
a ceramic main body having internal electrodes laminated therein; and
external electrodes formed on both ends of the ceramic main body in a length direction thereof,
wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and
when Tc is a thickness of a cover layer of the ceramic main body, Te is a thickness of the internal electrode, Td is a distance between neighboring internal electrodes, L 1 is a length from either end of the ceramic main body in the length direction thereof in a region in which the cover layer of the ceramic main body adjoins a margin part of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, and Lm is a length of the margin part of the ceramic main body, Tc≦70 μm and L 1 <Lm+Tc×cot 50° are satisfied.
2. The multilayer ceramic electronic component of claim 1 , wherein the multilayer ceramic electronic component is 1005-sized or greater.
3. The multilayer ceramic electronic component of claim 1 , wherein the conductive metal includes at least one selected from the group consisting of gold, silver, palladium, copper, nickel, and alloys thereof.
4. The multilayer ceramic electronic component of claim 1 , wherein the conductive resin includes at least one selected from the group consisting of a silver (Ag)-epoxy resin, a copper (Cu)-epoxy resin, and a copper (Cu)-coated silver (Ag) resin.
5. A multilayer ceramic electronic component, comprising:
a ceramic main body having internal electrodes alternately laminated therein; and
external electrodes formed on both ends of the ceramic main body in a length direction thereof,
wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and
when Tc is a thickness of a cover layer of the ceramic main body, Te is a thickness of the internal electrode, Td is a distance between neighboring internal electrodes, L 2 is a length from either end of the ceramic main body in the length direction thereof in a region in which the cover layer of the ceramic main body adjoins the internal electrode to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, and Lm is a length of a margin part of the ceramic main body, Tc≦70 μm and L 2 <Lm+(Tc+Te+Td)×cot 50° are satisfied.
6. The multilayer ceramic electronic component of claim 5 , wherein, when L 1 is a length from either end of the ceramic main body in the length direction thereof in a region in which the cover layer of the ceramic main body adjoins the margin part of the ceramic main body in the length direction thereof to the end of the first layer formed on the upper surface or the lower surface of the ceramic main body, L 1 <Lm+Tc×cot 50° is satisfied.
7. The multilayer ceramic electronic component of claim 5 , wherein the multilayer ceramic electronic component is 1005-sized or greater.
8. The multilayer ceramic electronic component of claim 5 , wherein the conductive metal includes at least one selected from the group consisting of gold, silver, palladium, copper, nickel, and alloys thereof.
9. The multilayer ceramic electronic component of claim 5 , wherein the conductive resin includes at least one selected from the group consisting of a silver (Ag)-epoxy resin, a copper (Cu)-epoxy resin, and a copper (Cu)-coated silver (Ag) resin.