IP Library › Granted Patent US 8,864,915
Granted Patent B2
US 8,864,915 · App. 13/197,614 · Granted Oct 21, 2014

Cleaning methods for improved photovoltaic module efficiency

Inventors: Renhe Jia (Berkeley, CA); Adam Brand (Palo Alto, CA); Liming Zhang (San Jose, CA); Dapeng Wang (Santa Clara, CA); Tzay-Fa Su (San Jose, CA); Vijay Parihar (Fremont, CA)
Assignee: Applied Materials, Inc.
B08B3/08B08B3/12H01L31/18Y02E10/50B23K26/16H01L31/0392B23K26/367
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Quick Facts
Patent No.
US 8,864,915
App. No.
13/197,614
Granted
Oct 21, 2014
Kind
B2
Abstract

A method of processing a substrate having a transparent conductive oxide disposed thereon, including: exposing the substrate to a first cleaning solution comprising hydrogen peroxide and ammonium citrate; exposing the substrate to a second cleaning solution having a pH within a range from about 6 to about 7, the second cleaning solution different than the first cleaning solution; agitating the second cleaning solution; and depositing a silicon-containing film on the transparent conductive oxide.

Claims (12)

1. A method of processing a substrate having a transparent conductive oxide disposed thereon, comprising:

exposing the substrate to a first cleaning solution comprising hydrogen peroxide and ammonium citrate;

exposing the substrate to a second cleaning solution having a pH within a range from about 6 to about 7, the second cleaning solution different than the first cleaning solution;

agitating the second cleaning solution; and

depositing a silicon-containing film on the transparent conductive oxide.

2. The method of claim 1 , further comprising scribing the surface of the substrate with a laser prior to the exposing the substrate to a second cleaning solution.

3. The method of claim 2 , wherein the agitating the second cleaning solution comprises removing particles of transparent conductive oxide from a surface of the substrate.

4. The method of claim 3 , wherein the agitating the second cleaning solution utilizes an ultrasonic mixer.

5. The method of claim 4 , wherein the second cleaning solution contains one or more compounds selected from the group consisting of potassium hydroxide, ammonium hydroxide, and hydrochloric acid.

6. The method of claim 1 , further comprising exposing the substrate to a first rinse solution after the exposing the substrate to a first cleaning solution and before the exposing the substrate to a second cleaning solution.

7. The method of claim 6 , wherein the rinse solution is deionized water.

8. The method of claim 7 , further comprising exposing the substrate a second rinse solution after agitating the second cleaning solution.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2011
From: JIA, RENHE; BRAND, ADAM; ZHANG, LIMING; WANG, DAPENG; SU, TZAY-FA; PARIHAR, VIJAY
To: APPLIED MATERIALS, INC.
Reel/Frame 026937/0926 →
Continuity (2)
Provisional Application 61373540 · Aug 13, 2010
Related Publication 20120037181A1 · Feb 16, 2012