IP Library Granted Patent US 8,875,813
Granted Patent B2
US 8,875,813 · App. 11/859,562 · Granted Nov 4, 2014

Atomic layer deposition nanocoatings on cutting tool powder materials

Inventors: Guodong Zhan (Spring, TX); Youhe Zhang (Tomball, TX); Feng Yu (Pleasant Grove, UT); Xian Yao (Sandy, UT); J. Daniel Belnap (Pleasant Grove, UT); Yuelin Shen (Houston, TX); Madapusi K. Keshavan (The Woodlands, TX)
Assignee: Smith International, Inc.
E21B10/46C22C26/00B22F2005/001C22C29/06B24D3/02
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Quick Facts
Patent No.
US 8,875,813
App. No.
11/859,562
Granted
Nov 4, 2014
Kind
B2
Abstract

A sintered body for cutting tools that includes hard particle phase comprising a plurality of hard particles, wherein at least a portion of the hard phase particles comprise a coating deposited by atomic layer deposition disposed thereon; and a binder phase is disclosed. The hard particles that may be included in the sintered bodies may include tungsten carbide, diamond, and boron nitride particles.

Claims (22)

1. A downhole cutting tool, comprising:

a tool body;

a plurality of sintered cutting elements attached to the tool body, wherein at least one of the plurality of sintered cutting elements comprise:

a diamond phase comprising a plurality of diamond particles, wherein at least a portion of the diamond particles comprises a conformal coating deposited by atomic layer deposition disposed across the surface of each diamond particle;

wherein the conformal coating comprises an oxide material selected from at least one of CoO, Al 2 O 3 , and SnO 2 ;

wherein an Al 2 O 3 coating or a SnO 2 coating further comprises a layer comprising Co or CoO thereon; and

a binder phase.

2. The downhole cutting tool of claim 1 , wherein the coating has a thickness ranging from about 1 to 10 nm.

3. The downhole cutting tool of claim 1 , wherein the plurality of diamond particles have a particle size of less than about 500 microns.

4. The downhole cutting tool of claim 1 , wherein the plurality of diamond particles have a particle size of less than about 100 microns.

5. The downhole cutting tool of claim 1 , wherein the coating on the plurality of diamond particles forms the binder phase of the at least one sintered cutting element.

6. The downhole cutting tool of claim 1 , wherein the conformal coating comprises Al 2 O 3 , and wherein a layer of cobalt is deposited by atomic layer deposition over the conformal coating.

7. A method of forming a downhole cutting tool, comprising:

coating a plurality of diamond particles by atomic layer deposition disposed thereon using a fluidized bed, wherein the coating comprises SnO 2 ;

sintering the plurality of coated diamond particles to form a sintered cutting element; and

attaching a plurality of sintered cutting elements to a cutting tool body.

8. The method of claim 7 , wherein the coating has a thickness of less than about 100 nm.

9. The method of claim 7 , wherein the coating has a thickness ranging from about 1 to 10 nm.

10. The method of claim 7 , further comprising:

adding a binder material to the coated particles prior to the sintering.

11. The method of claim 10 , wherein the binder material comprises Co.

12. The method of claim 7 , wherein the sintering comprises at least one of high pressure, high temperature sintering, hot pressing, infiltration, solid state or liquid phase sintering, pneumatic isostatic forging, spark plasma sintering, microwave sintering, hot isostatic pressing, and rapid omnidirectional compaction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2007
From: ZHAN, GUODONG; ZHANG, YOUHE; YU, FENG; YAO, XIAN; BELNAP, J. DANIEL; SHEN, YUELIN; KESHAVAN, MADAPUSI K.
To: SMITH INTERNATIONAL, INC.
Reel/Frame 020124/0115 →
Continuity (2)
Provisional Application 60846218 · Sep 21, 2006
Related Publication 20080073127A1 · Mar 27, 2008