IP Library Granted Patent US 8,880,749
Granted Patent B2
US 8,880,749 · App. 13/731,080 · Granted Nov 4, 2014

Apparatus for mixed signal interface circuitry and associated methods

Inventors: Jinwen Xiao (Austin, TX); Pavel Konecny (San Jose, CA); Axel Thomsen (Austin, TX); Clayton Daigle (Austin, TX); Xiaodong Wang (Austin, TX); John Khoury (Austin, TX); Alan Westwick (Austin, TX); Shahram Tadayon (Austin, TX)
Assignee: Silicon Laboratories Inc.
H01L25/00
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Quick Facts
Patent No.
US 8,880,749
App. No.
13/731,080
Granted
Nov 4, 2014
Kind
B2
Abstract

An integrated circuit (IC) includes a plurality of pads adapted to send or receive signals, and a plurality of mixed signal interface blocks, each of which is coupled to a corresponding pad in the plurality of pads. Furthermore, each mixed signal interface block in the plurality of mixed signal interface blocks is adapted to be configurable to provide selected functionality independently of the other mixed signal interface blocks.

Claims (32)

1. An integrated circuit (IC), comprising:

a plurality of pads adapted to send or receive signals; and

a plurality of mixed signal interface blocks to process both analog and digital signals, the plurality of the mixed signal interface blocks coupled to a digital core of the IC via a plurality of corresponding digital interfaces, each mixed signal interface block in the plurality of mixed signal interface blocks coupled to a corresponding pad in the plurality of pads;

wherein each mixed signal interface block in the plurality of mixed signal interface blocks is adapted to be configurable to provide selected functionality independently of other mixed signal interface blocks in the plurality of mixed signal interface blocks, and

wherein processing of analog signals provided to the plurality of mixed signal interface blocks occurs in the plurality of mixed signal interface blocks rather than the digital core of the IC.

2. The IC according to claim 1 , wherein at least one mixed signal interface block in the plurality of mixed signal interface blocks is adapted to provide digital input functionality.

3. The IC according to claim 1 , wherein at least one mixed signal interface block in the plurality of mixed signal interface blocks is adapted to provide digital output functionality.

4. The IC according to claim 1 , wherein at least one mixed signal interface block in the plurality of mixed signal interface blocks is adapted to provide general purpose input/output (GPIO) functionality.

5. The IC according to claim 1 , wherein at least one mixed signal interface block in the plurality of mixed signal interface blocks is adapted to provide digital to analog conversion functionality.

6. The IC according to claim 1 , wherein at least one mixed signal interface block in the plurality of mixed signal interface blocks is adapted to provide analog to digital conversion functionality.

7. The IC according to claim 1 , wherein each mixed signal interface block in the plurality of mixed signal interface blocks is coupled to core circuitry of the IC.

8. The IC according to claim 1 , wherein the plurality of pads comprises a subset of pads of the IC.

9. A mixed signal integrated circuit (IC), comprising:

a plurality of pads adapted to send or receive signals; and

a plurality of mixed signal interface blocks to process both analog and digital signals, the plurality of the mixed signal interface blocks coupled to core digital circuitry of the IC via a plurality of corresponding digital interfaces, each mixed signal interface block in the plurality of mixed signal interface blocks coupled to a corresponding pad in the plurality of pads and being dedicated to the corresponding pad in the plurality of pads;

wherein each mixed signal interface block in the plurality of mixed signal interface blocks is adapted to be configurable to provide at least one selected function from a set of functions to interface the corresponding pad in the plurality of pads with the core digital circuitry of the mixed signal IC, and

wherein processing of analog signals provided to the plurality of mixed signal interface blocks occurs in the plurality of mixed signal interface blocks rather than the core digital circuitry of the IC.

10. The mixed signal IC according to claim 9 , wherein each mixed signal interface block in the plurality of mixed signal interface blocks is dedicated to the corresponding pad in the plurality of pads to which the mixed signal interface block provides the at least one selected function.

11. The mixed signal IC according to claim 9 , wherein the set of functions comprises digital input and digital output functionality.

12. The mixed signal IC according to claim 11 , wherein the set of functions comprises analog input and analog output functionality.

13. The mixed signal IC according to claim 9 , wherein the set of functions comprises analog to digital conversion (ADC) functionality.

14. The mixed signal IC according to claim 13 , wherein the set of functions further comprises digital to analog conversion (ADC) functionality.

15. The mixed signal IC according to claim 9 , wherein the plurality of pads comprises a subset of pads of the IC.

16. A method of processing signals using a mixed signal integrated circuit (IC), the method comprising:

communicating signals with circuitry external to the mixed signal IC using a plurality of pads of the mixed signal IC;

providing the communicated signals to a plurality of mixed signal interface blocks that process both analog and digital signals, the plurality of the mixed signal interface blocks coupled to a digital core of the IC via a plurality of corresponding digital interfaces, each mixed signal interface block in the plurality of mixed signal interface blocks coupled to a corresponding pad to a plurality of pads; and

processing the communicated signals using the plurality of mixed signal interface blocks, wherein the processing by each mixed signal interface block in the plurality of mixed signal interface blocks may be performed independently of the processing by other mixed signal interface blocks in the plurality of mixed signal interface blocks, and

wherein processing of analog signals communicated to the plurality of mixed signal interface blocks occurs in the plurality of mixed signal interface blocks rather than the digital core of the IC.

17. The method according to claim 16 , wherein processing the communicated signals using the plurality of mixed signal interface blocks further comprises performing analog to digital conversion in some mixed signal interface blocks in the plurality of mixed signal interface blocks.

18. The method according to claim 16 , wherein processing the communicated signals using the plurality of mixed signal interface blocks further comprises performing digital to analog conversion in some mixed signal interface blocks in the plurality of mixed signal interface blocks.

19. The method according to claim 16 , further comprising configuring the processing by each mixed signal interface block in the plurality of mixed signal interface blocks.

20. The method according to claim 16 , wherein each mixed signal interface block in the plurality of mixed signal interface blocks is dedicated to a corresponding pad to a plurality of pads.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2013
From: XIAO, JINWEN; KONECNY, PAVEL; THOMSEN, AXEL; DAIGLE, CLAYTON; WANG, XIAODONG; KHOURY, JOHN; WESTWICK, ALAN; TADAYON, SHAHRAM
To: SILICON LABORATORIES INC.
Reel/Frame 030127/0562 →
Continuity (2)
Provisional Application 61666837 · Jun 30, 2012
Related Publication 20140002184A1 · Jan 2, 2014